• Item Name: ABLESTIK ABP 8060T
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: Silver paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
ABLESTIK ABP 8060T is a BMI hybrid silver paste engineered for high-performance die attach applications. It combines excellent thermal and electrical conductivity with hydrophobicity and high die shear strength, ensuring reliable operation under elevated temperatures. The adhesive serves as a robust alternative to soft solder, making it ideal for small to medium die sizes in power device assemblies requiring high thermal management and mechanical reliability.
Die attach for MOSFETs and power semiconductors
High thermal and electrical conductivity assemblies
Soft solder replacement in electronic devices requiring high reliability
| Property | Unit | Still Not Mixed | After Mixed |
|---|---|---|---|
| Thixotropic Index (0.5/5 rpm) | – | 6.0 | – |
| Viscosity, Brookfield CP51, 25°C, 5 rpm | mPa·s (cP) | 12,000 | – |
| Filler Content | % | 85 | – |
| Work Life @ 25°C | hours | 24 | – |
| Flash Point | – | See MSDS | – |
| Cure Schedule | – | 45 min ramp 25→200°C + 60 min @200°C | Alternative: 30 min ramp 25→175°C + 60 min @175°C |
| Coefficient of Thermal Expansion, TMA, Alpha 1 | ppm | – | 55 |
| Coefficient of Thermal Expansion, TMA, Alpha 2 | ppm | – | 120 |
| Tensile Modulus, DMTA @25°C | N/mm² (psi) | – | 6,230 (903,005) |
| Tensile Modulus, DMTA @250°C | N/mm² (psi) | – | 1,730 (251,495) |
| Extractable Ionic Content @100°C | ppm | – | Cl- <10, Na+ <10, K+ <10 |
| Thermal Conductivity | W/(m·K) | – | 20 |
| Volume Resistivity | ohm·cm | – | 2.5×10⁻⁵ |
| Die Shear Strength 1.27×1.27 mm @25°C | Kg | – | >2.3 |
| Die Shear Strength 1.27×1.27 mm @260°C | Kg | – | >1.3 |
| Die Shear Strength 1.02×1.02 mm Ag backmetal @25°C | Kg | – | >2.0 |
| Die Shear Strength 1.02×1.02 mm Ag backmetal @260°C | Kg | – | >1.3 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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