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Agomet® F 121 AB fast-curing methacrylate adhesive for bonding metals and plastics in series production, providing thermal stability and rapid handling strength.

  • Item Name: Agomet® F 121 AB

  • Manufacturer: Huntsman Advanced Materials

  • Technologies: Methyl methacrylate-based structural adhesive

  • Color: Contact to Techniq VN for details.

  • Cure Type: Room temperature curing

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 6 months

1. Product Overview

Agomet® F 121 AB is a fast-curing, two-part methacrylate adhesive designed for bonding metals and plastics in series production processes.

  • Room temperature curing.

  • Very short pot life: 3 – 5 minutes.

  • Handling strength after 6 – 8 minutes, full cure in ~2 hours.

  • Good thermal stability compared with typical MMA adhesives.

  • Mix ratio: 1:1 using standard dispensing equipment.


2. Applications

  • Bonding of metals: steel, aluminium, copper, alloys, ferrites.

  • Bonding of plastics: ABS, polystyrene, rigid PVC, polycarbonate.

  • Ideal for series/production lines requiring rapid assembly.

3. Typical Properties

A. Before Mixing

Component Appearance Viscosity (23°C) Specific Gravity Notes
F 121 A Liquid ~3.5 Pa·s ~1.0 Used 1:1 with F 121 B
F 121 B Liquid ~3.5 Pa·s ~1.0 Requires addition of 4–10% hardener powder (6% typical)

B. After Mixing & Processing

Property Value / Performance
Mixing Ratio Component A : (Component B + 6% hardener) = 1:1
Pot life 3 – 5 minutes
Handling strength 6 – 8 minutes (at RT)
Full cure ~2 hours (at RT)
Optimal adhesive application 150 – 250 g/m²
Storage life (A & B, sealed at 2–8°C) As per expiry date on packaging
Storage after mixing hardener into B 2 – 3 weeks only

C. Bonding Performance

Substrate (Tested per DIN 53 283) Tensile Shear Strength (N/mm²)
Aluminium (AlCuMg2pl) ~28
Brass ~23
Steel ~20
Rigid PVC Material rupture
Substrate (DIN 53 282, T-Peel Test) Peel Strength (N/mm)
Aluminium ~2

Temperature dependence: Tensile shear strength decreases with increasing temperature, retaining useful bonding up to ~120°C.

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