H10 Zero Halogen No Clean Solder Paste is a high-performance solder paste with strong activity, leaving minimal high-SIR residues. It offers excellent transfer efficiency, reduces voiding on BGA, BTC, and LGA components, and improves electrochemical reliability on low stand-off devices.
| Property | Test Method | Results |
|---|---|---|
| Flux Classification | J-STD-004 B and C | ROL0 |
| Copper Mirror Test | IPC-TM-650 2.3.32 | No breakthrough (Low Activity) |
| Corrosion Test | IPC-TM-650 2.6.15 | No corrosion |
| Halide Content (Quantitative) | IPC-TM-650 2.3.28.1 | <0.05% (Cl = 0 ppm, Br = 0 ppm, F = 0 ppm, I = 0 ppm) |
| Halogen Content | EN 14582 | Halogen-Free |
| Surface Insulation Resistance | IPC-TM-650 2.6.3.7 | ≥ 100 MΩ (No-clean state) |
| Electromigration Resistance | BELLCORE GR-78-CORE 13.2.7 | PASS |
| Flux Solids Content | IPC-TM-650 2.3.34 | 74% |
| Acid Value | IPC-TM-650 2.3.13 | 174.2 mg KOH/g |
| Viscosity (Malcom) | IPC-TM-650 2.4.34 | 150-250 Pas (Typical for SAC305 T4) |
| Slump Test | IPC-TM-650 2.4.35 | PASS |
| Tack Value | JIS Z 3284 / IPC-TM-650 | PASS |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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