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AIM H10 Zero Halogen No Clean Solder Paste – superior electrochemical performance

  • Item Number: H10
  • Manufacturer: AIM
  • Halogen-Free: Yes
  • Lead Type: Lead-Free (Available in SAC305, SN100C®, REL22™, and REL61™)
  • Powder Sizes: T4 and T5
  • Transfer Efficiency: >90% at 0.50 AR with T4
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

H10 Zero Halogen No Clean Solder Paste is a high-performance solder paste with strong activity, leaving minimal high-SIR residues. It offers excellent transfer efficiency, reduces voiding on BGA, BTC, and LGA components, and improves electrochemical reliability on low stand-off devices.

2. Applications

  • Suitable for fine-pitch and low-voiding applications in BGA, BTC, LGA, and QFN components.
  • Works with SAC305, SN100C®, REL22™, and REL61™ alloys.
  • Compatible with stencil printing processes with T4 and T5 powder sizes.

3. Typical Properties

Property Test Method Results
Flux Classification J-STD-004 B and C ROL0
Copper Mirror Test IPC-TM-650 2.3.32 No breakthrough (Low Activity)
Corrosion Test IPC-TM-650 2.6.15 No corrosion
Halide Content (Quantitative) IPC-TM-650 2.3.28.1 <0.05% (Cl = 0 ppm, Br = 0 ppm, F = 0 ppm, I = 0 ppm)
Halogen Content EN 14582 Halogen-Free
Surface Insulation Resistance IPC-TM-650 2.6.3.7 ≥ 100 MΩ (No-clean state)
Electromigration Resistance BELLCORE GR-78-CORE 13.2.7 PASS
Flux Solids Content IPC-TM-650 2.3.34 74%
Acid Value IPC-TM-650 2.3.13 174.2 mg KOH/g
Viscosity (Malcom) IPC-TM-650 2.4.34 150-250 Pas (Typical for SAC305 T4)
Slump Test IPC-TM-650 2.4.35 PASS
Tack Value JIS Z 3284 / IPC-TM-650 PASS

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