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AIM J8 No Clean Jetting Solder Paste – High-performance jetting solder paste for precision applications

  • Item Number: J8
  • Manufacturer: AIM
  • Lead Type: Lead-Free and Leaded (Available in SAC305 and Sn63)
  • Type: No Clean
  • Minimum Deposit Size: 200μm
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

J8 No Clean Jetting Solder Paste is designed for precision jetting applications, capable of forming solder deposits as small as 200μm. It offers low voiding performance (<5% on BGA and <10% on BTC components) and eliminates Head-in-Pillow (HiP) defects. The paste provides powerful wetting on lead-free surface finishes, ensuring bright and reliable solder joints. It is REACH and RoHS compliant, passes Bono Testing, and is available in SAC305 and Sn63 alloys.

2. Applications

  • Jetting applications requiring precise solder deposits
  • Use with jetting equipment for SMT assembly
  • Combining jetted paste deposits with printed paste deposits
  • Suitable for components like BGAs and BTCs requiring low voiding
  • Lead-free soldering applications

3. Typical Properties – Specifications

Property Specification
Solder Alloy SAC305, Sn63
Deposit Size 200μm
Voiding on BGA <5%
Voiding on BTC <10%
Flux Classification ROL0 (J-STD-004), ROL1 (J-STD-004B)
Halogen Content Low
Shelf Life (Sealed, Refrigerated) 6 months (0°C-12°C)
Shelf Life (Sealed, Unrefrigerated) 2 days (<25°C)
Surface Insulation Resistance >100MΩ
Flux Solids (Nonvolatile) 94.77%
Acid Value 135.95 mgKOH/g flux
Viscosity 200-500 Kcps
Bono Testing Pass
Corrosion Test Pass
Solder Ball Test Pass
Tack Force 36.1 gf

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