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AIM M8 No Clean Solder Paste – Advanced performance for fine-pitch applications

  • Item Number: M8
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Compatible with T4, T5, and finer powders
  • Type: No Clean
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

M8 No Clean Solder Paste is designed for high-performance soldering applications, ensuring low voiding (<5% on BGA, <10% on BTC) and superior print transfer efficiency. It eliminates HiP defects, meets REACH and RoHS compliance, and provides powerful wetting on lead-free surface finishes. The formulation supports T4, T5, and finer powders, leaving minimal transparent residue suitable for LED applications.

2. Applications

  • Designed for UFP and umBGA devices
  • Suitable for automotive and high-reliability electronics
  • Works with leaded and lead-free alloy powders
  • Compatible with SMT assembly requiring low voiding and high print efficiency

3. Typical Properties

Property Test Method Typical Results
Flux Classification IPC J-STD-004 A & B ROL0, ROL1
Mass Density (SAC305) 4.2 g/cm³
Copper Mirror Test IPC-TM-650 2.3.32 LOW
Corrosion Test IPC-TM-650 2.6.15 PASS
Halides (Cl Content) J-STD-004B 3.4.1.3 0.0%
Surface Insulation Resistance (SIR) IPC-TM-650 2.6.3.7 >100 MΩ
Electrochemical Migration IPC-TM-650 2.6.14.1 PASS
Flux Residue Dryness IPC-TM-650 2.4.47 PASS
Flux Solids Content IPC-TM-650 2.3.34 94.8%
Acid Value IPC-TM-650 2.3.13 136 mgKOH/g flux
Viscosity (Brookfield) IPC-TM-650 2.4.34 400-1000 Kcps
Viscosity (Malcom) IPC-TM-650 2.4.34 70-300 Pa.S
Slump Test IPC-TM-650 2.4.35 PASS
Solder Balling IPC-TM-650 2.4.43 PASS
Tack Strength (JIS Z 3284) 105.92 gf

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