M8 No Clean Solder Paste is designed for high-performance soldering applications, ensuring low voiding (<5% on BGA, <10% on BTC) and superior print transfer efficiency. It eliminates HiP defects, meets REACH and RoHS compliance, and provides powerful wetting on lead-free surface finishes. The formulation supports T4, T5, and finer powders, leaving minimal transparent residue suitable for LED applications.
| Property | Test Method | Typical Results |
|---|---|---|
| Flux Classification | IPC J-STD-004 A & B | ROL0, ROL1 |
| Mass Density (SAC305) | – | 4.2 g/cm³ |
| Copper Mirror Test | IPC-TM-650 2.3.32 | LOW |
| Corrosion Test | IPC-TM-650 2.6.15 | PASS |
| Halides (Cl Content) | J-STD-004B 3.4.1.3 | 0.0% |
| Surface Insulation Resistance (SIR) | IPC-TM-650 2.6.3.7 | >100 MΩ |
| Electrochemical Migration | IPC-TM-650 2.6.14.1 | PASS |
| Flux Residue Dryness | IPC-TM-650 2.4.47 | PASS |
| Flux Solids Content | IPC-TM-650 2.3.34 | 94.8% |
| Acid Value | IPC-TM-650 2.3.13 | 136 mgKOH/g flux |
| Viscosity (Brookfield) | IPC-TM-650 2.4.34 | 400-1000 Kcps |
| Viscosity (Malcom) | IPC-TM-650 2.4.34 | 70-300 Pa.S |
| Slump Test | IPC-TM-650 2.4.35 | PASS |
| Solder Balling | IPC-TM-650 2.4.43 | PASS |
| Tack Strength (JIS Z 3284) | – | 105.92 gf |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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