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AIM NC257MD No Clean Solder Paste – Specifically engineered for Mycronic Jet Printers.

  • Item Number: NC257MD
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Compatible with various lead-free alloys
  • Type: No Clean
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

NC257MD is a no-clean solder paste specially developed for Mycronic Jet Printers, designed to provide consistent and reliable jet printing performance. It features clear, pin-probe testable residues, excellent wetting properties, and low voiding under micro-BGAs and BTC devices. The paste is optimized for use with the Mycronic AG Type Ejector, prolonging ejector life and reducing paste consumption. It supports vapor phase compatibility and maintains an 8-12 hour tack time for stable performance during assembly.

2. Applications

  • Jet printing applications, specifically for Mycronic Jet Printers.
  • Electronics manufacturing requiring precise and consistent solder deposition.
  • Lead-free soldering with high-reliability requirements.
  • Assembly of fine-pitch components, including BGA and BTC devices, minimizing voiding.

3. Typical Properties – Specifications

Property Test Method Results
IPC Flux Classification J-STD-004, J-STD-004B 3.3.1 ROL0, ROL1
Copper Mirror IPC-TM-650 2.3.32 Low
Corrosion IPC-TM-650 2.6.15 PASS
Quantitative Halides IPC-TM-650 2.3.28.1 L1
Qualitative Halides (Silver Chromate) IPC-TM-650 2.3.33 PASS
Qualitative Halides (Fluoride Spot) IPC-TM-650 2.3.35.1 No Fluoride
Surface Insulation Resistance (SIR) IPC-TM-650 2.6.3.7 PASS
Electrochemical Migration IPC-TM-650 2.6.14.1 PASS
Flux Solids Content IPC-TM-650 2.3.34 86.9%
Acid Value IPC-TM-650 2.3.13 149 mg KOH/g
Flux Specific Gravity ASTM D-1298 3.39
Viscosity IPC-TM-650 2.4.34 450-550 Kcps
Slump Resistance IPC-TM-650 2.4.35 PASS
Solder Ball Test IPC-TM-650 2.4.43 PASS
Tack Force IPC-TM-650 2.4.44 32.8 gf
Wetting Performance IPC-TM-650 2.4.45 PASS
Visual Appearance Gray, Smooth, Creamy

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