NC257MD is a no-clean solder paste specially developed for Mycronic Jet Printers, designed to provide consistent and reliable jet printing performance. It features clear, pin-probe testable residues, excellent wetting properties, and low voiding under micro-BGAs and BTC devices. The paste is optimized for use with the Mycronic AG Type Ejector, prolonging ejector life and reducing paste consumption. It supports vapor phase compatibility and maintains an 8-12 hour tack time for stable performance during assembly.
| Property | Test Method | Results |
|---|---|---|
| IPC Flux Classification | J-STD-004, J-STD-004B 3.3.1 | ROL0, ROL1 |
| Copper Mirror | IPC-TM-650 2.3.32 | Low |
| Corrosion | IPC-TM-650 2.6.15 | PASS |
| Quantitative Halides | IPC-TM-650 2.3.28.1 | L1 |
| Qualitative Halides (Silver Chromate) | IPC-TM-650 2.3.33 | PASS |
| Qualitative Halides (Fluoride Spot) | IPC-TM-650 2.3.35.1 | No Fluoride |
| Surface Insulation Resistance (SIR) | IPC-TM-650 2.6.3.7 | PASS |
| Electrochemical Migration | IPC-TM-650 2.6.14.1 | PASS |
| Flux Solids Content | IPC-TM-650 2.3.34 | 86.9% |
| Acid Value | IPC-TM-650 2.3.13 | 149 mg KOH/g |
| Flux Specific Gravity | ASTM D-1298 | 3.39 |
| Viscosity | IPC-TM-650 2.4.34 | 450-550 Kcps |
| Slump Resistance | IPC-TM-650 2.4.35 | PASS |
| Solder Ball Test | IPC-TM-650 2.4.43 | PASS |
| Tack Force | IPC-TM-650 2.4.44 | 32.8 gf |
| Wetting Performance | IPC-TM-650 2.4.45 | PASS |
| Visual Appearance | – | Gray, Smooth, Creamy |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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