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AIM NC258 No Clean Solder Paste – for long pause-to-print capabilities

  • Item Number: NC258
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Compatible with various lead-free alloys
  • Type: No Clean
  • Shelf Life: Contact Techniq VN for details.
  1. Product Overview
    NC258 is a no-clean solder paste designed to provide long pause-to-print capabilities while ensuring fine print definition and reducing voiding. It offers excellent wetting properties, resulting in bright and smooth solder joints. The low post-process residues remain crystal clear even under high temperatures required for lead-free alloys. NC258 is RoHS compliant and passes Bono testing.
  2. Applications
  • Suitable for fine-pitch and leadless devices.
  • Used in electronics assembly requiring low-voiding solder joints.
  • Ideal for applications demanding long pause-to-print capabilities.
  • Recommended for high-reliability soldering with minimal post-reflow residues.
  1. Typical Properties – Specifications
Property Test Method Result
IPC Flux Classification J-STD-004 ROL0
IPC Flux Classification J-STD-004B 3.3.1 ROL1
Copper Mirror J-STD-004B 3.4.1.1 / IPC-TM-650 2.3.32 Low
Corrosion J-STD-004B 3.4.1.2 / IPC-TM-650 2.6.15 Pass
Quantitative Halides (Br, Cl) J-STD-004 3.2.4.3.1 / IPC-TM-650 2.3.35 Br: 0.33%, Cl: 0%
Qualitative Halides (Silver Chromate) J-STD-004B 3.5.1.1 / IPC-TM-650 2.3.33 Pass
Qualitative Halides (Fluoride Spot) J-STD-004B 3.5.1.2 / IPC-TM-650 2.3.35.1 No Fluoride
Surface Insulation Resistance J-STD-004B 3.4.1.4 / IPC-TM-650 2.6.3.7 Pass
Bono Testing Pass (Fc<8.0 Typical)
Oxygen Bomb Halogen Testing EN14582:2007 / SW 9056 / SW 5050 Br <50.1 mg/Kg, Cl <125 mg/Kg
Electrochemical Migration J-STD-004B 3.4.1.5 / IPC-TM-650 2.6.14.1 Pass
Flux Solids (Nonvolatile Determination) J-STD-004B 3.4.2.1 / IPC-TM-650 2.3.34 99.9% Typical
Acid Value Determination J-STD-004B 3.4.2.2 / IPC-TM-650 2.3.13 145 ± 6mg KOH/g Flux
Flux Specific Gravity J-STD-004B 3.4.2.3 / ASTM D-1298 0.92 Typical
Viscosity J-STD-005A 3.5.1 / IPC-TM-650 2.4.34 600-900 (depends on metal load and particle size)
Slump J-STD-005A 3.6 / IPC-TM-650 2.4.35 Pass
Solder Ball J-STD-005A 3.7 / IPC-TM-650 2.4.43 Pass
Tack J-STD-005A 3.8 / IPC-TM-650 2.4.44 37.9g Typical
Wetting J-STD-005A 3.9 / IPC-TM-650 2.4.45 Pass

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