1. Product Overview

AIM’s NC259 is a no-clean solder paste designed for use with no/low-silver alloys while maintaining the performance of high-silver SAC alloys. It features high transfer efficiency, precise print definition, and pause-to-print capabilities exceeding 8 hours. The NC259 activator system enables excellent wetting even without silver and withstands peak reflow temperatures up to 260°C. When combined with SN100C®, it produces bright, smooth solder joints with minimal voiding in BGA and BTC packages.

2. Applications

• Suitable for PCB assembly using no/low-silver alloys
• Ideal for fine-feature printing and high-speed printing (up to 150mm/sec)
• Reduces defects such as voiding and head-in-pillow
• Leaves minimal residue post-reflow, eliminating the need for cleaning