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AIM NC259FPA Ultrafine No Clean Solder Paste – ultrafine printing with Type 6 and smaller alloy powders

  • Item Number: NC259FPA
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Available in Type 6 and finer powders
  • Type: No Clean, Ultrafine Printing
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

NC259FPA is an ultrafine no-clean solder paste developed by AIM for use with Type 6 and finer solder powder. It provides high transfer efficiency, precise print definition, and excellent wetting with shear values up to 150 gf. The flux residue is water-clear and has high surface insulation resistance (SIR). This solder paste offers a long stencil life of up to 8 hours and is recommended for nitrogen reflow. It is also zero-halogen and meets industry standards.

2. Applications

  • Designed for use with Type 6 and smaller alloy powder.
  • Suitable for high-precision soldering applications.
  • Ideal for electronics manufacturing requiring clean and strong solder joints.
  • Used in mass transfer assembly with high tack force requirements.

3. Typical Properties – Specifications

Property Test Method Results
IPC Flux Classification J-STD-004A, B, C 3.3 ROL0
Copper Mirror IPC-TM-650 2.3.32 No breakthrough
Corrosion IPC-TM-650 2.6.15 No corrosion
Quantitative Halides IPC-TM-650 2.3.28.1 <0.05% (Low)
Qualitative Halides IPC-TM-650 2.3.33 (Silver Chromate) PASS
Halogen Content EN 14582 Halogen-free
Surface Insulation Resistance (SIR) IPC-TM-650 2.6.3.7 ≥ 100 MΩ (No-clean state)
Flux Solids Content IPC-TM-650 2.3.34 74% solids
Acid Value IPC-TM-650 2.3.13 174.2 mg KOH/g
Viscosity (Malcom) IPC-TM-650 2.4.34 170-210 PaS*
Slump Resistance IPC-TM-650 2.4.35 PASS
Tack Force JIS standard Z 3284 120 gf

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