NC257MD is a no-clean solder paste specifically developed for Mycronic Jet Printers. It features unique rheological properties to ensure consistent and continuous deposits, reducing paste consumption and prolonging ejector life. The solder paste provides excellent wetting, bright and shiny solder joints, and minimal voiding under BGA and BTC devices. It also leaves behind crystal-clear, low-residue flux, even at high temperatures required for lead-free alloys.
| Parameter | Test Method | Result |
|---|---|---|
| IPC Flux Classification | J-STD-004 / J-STD-004B | ROL0 / ROL1 |
| Copper Mirror Test | J-STD-004B 3.4.1.1 | Low |
| Corrosion Resistance | J-STD-004B 3.4.1.2 | Pass |
| Quantitative Halides | J-STD-004B 3.4.1.3 | L1 |
| Silver Chromate Test | J-STD-004B 3.5.1.1 | Pass |
| Fluoride Spot Test | J-STD-004B 3.5.1.2 | No Fluoride |
| Surface Insulation Resistance | J-STD-004B 3.4.1.4 | Pass |
| Electrochemical Migration | J-STD-004B 3.4.1.5 | Pass |
| Flux Solids (Non-volatile) | J-STD-004B 3.4.2.1 | 86.9% |
| Acid Value | J-STD-004B 3.4.2.2 | 149 mg KOH/g flux |
| Specific Gravity | ASTM D-1298 | 3.39 |
| Viscosity | J-STD-005A 3.5.1 | 500 Kcps |
| Appearance | J-STD-004B 3.4.2.5 | Gray, smooth, creamy |
| Slump Test | J-STD-005A 3.6 | Pass |
| Solder Ball Test | J-STD-005A 3.7 | Pass |
| Tack Test | J-STD-005A 3.8 | 32.8 gf |
| Wetting Test | J-STD-005A 3.9 | Pass |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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