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AIM Solder Paste – NC257MD No Clean Solder Paste – Specially engineered for Mycronic Jet Printers, micro-BGAs.

  • Item Number: NC257MD
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Contact to Techniq VN for details.
  • Type: No Clean Solder Paste
  • Package: Contact to Techniq VN for details.
  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

NC257MD is a no-clean solder paste specifically developed for Mycronic Jet Printers. It features unique rheological properties to ensure consistent and continuous deposits, reducing paste consumption and prolonging ejector life. The solder paste provides excellent wetting, bright and shiny solder joints, and minimal voiding under BGA and BTC devices. It also leaves behind crystal-clear, low-residue flux, even at high temperatures required for lead-free alloys.

2. Applications

  • Designed for Mycronic Jet Printers with AG Type Ejectors
  • Suitable for use in vapor phase soldering
  • Reduces voiding in micro-BGA and BTC components
  • Ideal for applications requiring clear, pin-probe testable residues
  • Provides an extended tack time of 8-12 hours

3. Typical Properties – Specifications

Parameter Test Method Result
IPC Flux Classification J-STD-004 / J-STD-004B ROL0 / ROL1
Copper Mirror Test J-STD-004B 3.4.1.1 Low
Corrosion Resistance J-STD-004B 3.4.1.2 Pass
Quantitative Halides J-STD-004B 3.4.1.3 L1
Silver Chromate Test J-STD-004B 3.5.1.1 Pass
Fluoride Spot Test J-STD-004B 3.5.1.2 No Fluoride
Surface Insulation Resistance J-STD-004B 3.4.1.4 Pass
Electrochemical Migration J-STD-004B 3.4.1.5 Pass
Flux Solids (Non-volatile) J-STD-004B 3.4.2.1 86.9%
Acid Value J-STD-004B 3.4.2.2 149 mg KOH/g flux
Specific Gravity ASTM D-1298 3.39
Viscosity J-STD-005A 3.5.1 500 Kcps
Appearance J-STD-004B 3.4.2.5 Gray, smooth, creamy
Slump Test J-STD-005A 3.6 Pass
Solder Ball Test J-STD-005A 3.7 Pass
Tack Test J-STD-005A 3.8 32.8 gf
Wetting Test J-STD-005A 3.9 Pass

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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