Industries

AIM Solder Paste – NC273LT No Clean Solder Paste – Low-temperature applications

  • Item Number: NC273LT
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Bismuth-based alloy
  • Type: No Clean Solder Paste
  • Package: Contact to Techniq VN for details.
  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

AIM NC273LT is a no-clean, low-temperature solder paste designed for bismuth alloys. It features an advanced activator system that improves wetting on RoHS-compliant surface finishes. This halogen-free paste offers excellent stencil life (>8 hours), minimal solder balling, and superior wetting. With a peak reflow temperature as low as 170°C-185°C, it is an ideal replacement for lead-free applications where thermal exposure is a concern.


2. Applications

  • Low-temperature SMT assembly
  • Bismuth-based soldering applications
  • RoHS-compliant PCB assembly
  • Fine-pitch and high-reliability electronics
  • Assemblies where thermal sensitivity is a limitation

3. Typical Properties

Handling & Storage

Condition Shelf Life Temperature
Sealed, Frozen 6 months < 0°C (32°F)
Sealed, Refrigerated 4 months 0°C – 12°C (32°F-55°F)
Sealed, Unrefrigerated 2 weeks < 25°C (77°F)
  • Do not mix used paste with unused paste
  • Store tightly sealed with internal plug or cap
  • Shelf life depends on storage conditions and handling

Printing Parameters

Parameter Recommended Setting
Squeegee Pressure 0.9 – 1.5 lbs/inch of blade
Squeegee Speed 0.5 – 6 inches/second
Snap-off Distance On Contact (0.00 mm)
PCB Separation Distance 0.75 – 2.0 mm
PCB Separation Speed 3 – 20 mm/second

Reflow Profile

Phase Temperature / Time
Rate of Rise 1-3°C/sec max
Ramp to 100°C ≤ 75 sec
Progress to 140°C 30-60 sec
Time to Peak (170-185°C) 45-75 sec
Time Above 138°C 50-80 sec (recommended: 45±15 sec)
Cooldown Rate ≤ 4°C/sec
Total Time to Spike 2.75 – 3.5 min

Test Data Summary

Property Test Method Result
Flux Classification (IPC) J-STD-004 / J-STD-004B ROL0 / ROL1
Copper Mirror Test J-STD-004B 3.4.1.1 Low
Corrosion Test J-STD-004B 3.4.1.2 Pass
Halide Content (Br/Cl) EN14582 <900ppm Br/Cl, <1500ppm Combined
Surface Insulation Resistance J-STD-004B 3.4.1.4 Pass
Viscosity (Print Formula) J-STD-005A 3.5.1 750kcps Typical
Viscosity (Dispense Formula) J-STD-005A 3.5.1 400kcps Typical
Tack Strength J-STD-005A 3.8 55.3 gf Typical
Solder Ball Test J-STD-005A 3.7 Pass
Wetting Test J-STD-005A 3.9 Pass
Slump Test J-STD-005A 3.6 Pass
Acid Value J-STD-004B 3.4.2.2 159.4 mg KOH/g flux
Flux Specific Gravity ASTM D-1298 0.98 Typical

RELATED PRODUCT

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.