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AIM Solder Paste – NC273LT No Clean Solder Paste – Low-temperature applications

  • Item Number: NC273LT
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Bismuth-based alloy
  • Type: No Clean Solder Paste
  • Package: Contact to Techniq VN for details.
  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

AIM NC273LT is a no-clean, low-temperature solder paste designed for bismuth alloys. It features an advanced activator system that improves wetting on RoHS-compliant surface finishes. This halogen-free paste offers excellent stencil life (>8 hours), minimal solder balling, and superior wetting. With a peak reflow temperature as low as 170°C-185°C, it is an ideal replacement for lead-free applications where thermal exposure is a concern.


2. Applications

  • Low-temperature SMT assembly
  • Bismuth-based soldering applications
  • RoHS-compliant PCB assembly
  • Fine-pitch and high-reliability electronics
  • Assemblies where thermal sensitivity is a limitation

3. Typical Properties

Handling & Storage

Condition Shelf Life Temperature
Sealed, Frozen 6 months < 0°C (32°F)
Sealed, Refrigerated 4 months 0°C – 12°C (32°F-55°F)
Sealed, Unrefrigerated 2 weeks < 25°C (77°F)
  • Do not mix used paste with unused paste
  • Store tightly sealed with internal plug or cap
  • Shelf life depends on storage conditions and handling

Printing Parameters

Parameter Recommended Setting
Squeegee Pressure 0.9 – 1.5 lbs/inch of blade
Squeegee Speed 0.5 – 6 inches/second
Snap-off Distance On Contact (0.00 mm)
PCB Separation Distance 0.75 – 2.0 mm
PCB Separation Speed 3 – 20 mm/second

Reflow Profile

Phase Temperature / Time
Rate of Rise 1-3°C/sec max
Ramp to 100°C ≤ 75 sec
Progress to 140°C 30-60 sec
Time to Peak (170-185°C) 45-75 sec
Time Above 138°C 50-80 sec (recommended: 45±15 sec)
Cooldown Rate ≤ 4°C/sec
Total Time to Spike 2.75 – 3.5 min

Test Data Summary

Property Test Method Result
Flux Classification (IPC) J-STD-004 / J-STD-004B ROL0 / ROL1
Copper Mirror Test J-STD-004B 3.4.1.1 Low
Corrosion Test J-STD-004B 3.4.1.2 Pass
Halide Content (Br/Cl) EN14582 <900ppm Br/Cl, <1500ppm Combined
Surface Insulation Resistance J-STD-004B 3.4.1.4 Pass
Viscosity (Print Formula) J-STD-005A 3.5.1 750kcps Typical
Viscosity (Dispense Formula) J-STD-005A 3.5.1 400kcps Typical
Tack Strength J-STD-005A 3.8 55.3 gf Typical
Solder Ball Test J-STD-005A 3.7 Pass
Wetting Test J-STD-005A 3.9 Pass
Slump Test J-STD-005A 3.6 Pass
Acid Value J-STD-004B 3.4.2.2 159.4 mg KOH/g flux
Flux Specific Gravity ASTM D-1298 0.98 Typical

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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