AIM NC273LT is a no-clean, low-temperature solder paste designed for bismuth alloys. It features an advanced activator system that improves wetting on RoHS-compliant surface finishes. This halogen-free paste offers excellent stencil life (>8 hours), minimal solder balling, and superior wetting. With a peak reflow temperature as low as 170°C-185°C, it is an ideal replacement for lead-free applications where thermal exposure is a concern.
| Condition | Shelf Life | Temperature |
|---|---|---|
| Sealed, Frozen | 6 months | < 0°C (32°F) |
| Sealed, Refrigerated | 4 months | 0°C – 12°C (32°F-55°F) |
| Sealed, Unrefrigerated | 2 weeks | < 25°C (77°F) |
| Parameter | Recommended Setting |
|---|---|
| Squeegee Pressure | 0.9 – 1.5 lbs/inch of blade |
| Squeegee Speed | 0.5 – 6 inches/second |
| Snap-off Distance | On Contact (0.00 mm) |
| PCB Separation Distance | 0.75 – 2.0 mm |
| PCB Separation Speed | 3 – 20 mm/second |
| Phase | Temperature / Time |
|---|---|
| Rate of Rise | 1-3°C/sec max |
| Ramp to 100°C | ≤ 75 sec |
| Progress to 140°C | 30-60 sec |
| Time to Peak (170-185°C) | 45-75 sec |
| Time Above 138°C | 50-80 sec (recommended: 45±15 sec) |
| Cooldown Rate | ≤ 4°C/sec |
| Total Time to Spike | 2.75 – 3.5 min |
| Property | Test Method | Result |
|---|---|---|
| Flux Classification (IPC) | J-STD-004 / J-STD-004B | ROL0 / ROL1 |
| Copper Mirror Test | J-STD-004B 3.4.1.1 | Low |
| Corrosion Test | J-STD-004B 3.4.1.2 | Pass |
| Halide Content (Br/Cl) | EN14582 | <900ppm Br/Cl, <1500ppm Combined |
| Surface Insulation Resistance | J-STD-004B 3.4.1.4 | Pass |
| Viscosity (Print Formula) | J-STD-005A 3.5.1 | 750kcps Typical |
| Viscosity (Dispense Formula) | J-STD-005A 3.5.1 | 400kcps Typical |
| Tack Strength | J-STD-005A 3.8 | 55.3 gf Typical |
| Solder Ball Test | J-STD-005A 3.7 | Pass |
| Wetting Test | J-STD-005A 3.9 | Pass |
| Slump Test | J-STD-005A 3.6 | Pass |
| Acid Value | J-STD-004B 3.4.2.2 | 159.4 mg KOH/g flux |
| Flux Specific Gravity | ASTM D-1298 | 0.98 Typical |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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