Item Number: REL61
Manufacturer: AIM Solder
Alloy/Composition: Tin with bismuth, silver, copper micro-element refiners
Diameter/ Size Range: Bar (1.1 kg / 2.5 lb), solid feeder wire (3.175 mm / 0.125”)
Flux Type/ Core: Compatible with no-clean solder paste (M8 T4)
Melting Temperature: 208–215°C
Packaging: Contact to Techniq VN for details.
Shelf Life: 7 years at room temperature
1. Product Overview
REL61™ is a lead-free solder alloy developed by AIM, composed of tin, bismuth, silver, copper, and grain structure refiners. It provides a cost-effective alternative to SAC alloys while delivering performance equal to SAC305 and superior to other low/no-silver alloys. REL61 reduces tin whisker formation and demonstrates enhanced resistance to thermal shock, vibration, and drop shock. Its lower reflow and solder pot temperature requirements make it highly efficient for lead-free soldering processes. The alloy complies with IPC J-STD-006 standards.
2. Applications
REL61 is designed exclusively for lead-free soldering processes and is widely applicable in electronics assembly. It is available in bar form, solid feeder wire, and no-clean solder paste. Its robust mechanical and thermal properties make it suitable for demanding environments where reliability, durability, and cost efficiency are critical.
3. Typical Properties – Specifications
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