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AIM V9 No Clean Solder Paste -high-reliability for BGA, BTC, and LED

  • Item Number: V9
  • Manufacturer: AIM
  • Lead Type: Lead-Free
  • Alloys: Available in SAC305 T4
  • Type: No Clean, Low Voiding
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

V9 Low-Voiding No Clean Solder Paste is designed for minimal voiding on BGA, BTC, and LED soldering applications. It ensures high print stability for over 12 hours on fine-feature devices and provides excellent pin-probe performance with high Surface Insulation Resistance (SIR). This product is REACH and RoHS compliant, available in SAC305 T4, and offers a drop-in replacement for M8 solder paste.

2. Applications

  • Soldering for BGA (Ball Grid Array), BTC (Bottom Termination Components), and LED assemblies.
  • Suitable for various surface finishes, including ENIG (Electroless Nickel Immersion Gold), ImSn (Immersion Tin), and OSP (Organic Solderability Preservative).
  • Used in fine-feature electronic assemblies requiring high reliability and low voiding.

3. Typical Properties – Specifications

Property Test Method Typical Results
Flux Classification J-STD-004 / J-STD-004B ROL0 / ROL1
Copper Mirror Test J-STD-004B 3.4.1.1 Low
Corrosion Test J-STD-004B 3.4.1.2 Pass
Quantitative Halides J-STD-004B 3.4.1.3 Br: 0.44%, Cl: 0.0%
Surface Insulation Resistance (SIR) J-STD-004B 3.4.1.4 > 100 MΩ
Flux Solids Content J-STD-004B 3.4.2.1 94.14%
Acid Value J-STD-004B 3.4.2.2 139.03 mg KOH/g
Viscosity (Malcom, Pa·s) J-STD-005A 3.5.1 130-200 Pa·s
Slump Test J-STD-005A 3.6 Pass
Spread Test J-STD-004B 3.7.2 Pass
Solder Ball Test J-STD-005A 3.7 Pass
Tack Test (J-STD-005A) IPC-TM-650 2.4.44 36.1 gf
Tack Test (JIS Z 3284 Annex 9) 82.5 gf

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