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AIM WS488 Water Soluble Solder Paste – High-performance

  • Item Number: WS488
  • Manufacturer: AIM
  • Lead Type: Available in Lead-Free and Leaded Versions
  • Alloys: Contact Avantek for details.
  • Type: Water Soluble Solder Paste
  • Package: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

WS488 is a water-soluble solder paste engineered for superior wetting on various electronic surfaces, components, and assemblies. It provides excellent print characteristics, extended stencil life (8+ hours), and robust environmental tolerance. WS488 is compatible with both leaded and lead-free alloys. Its residues are highly soluble and easily cleaned with plain water, making it a reliable choice for high-performance soldering applications.

2. Applications

  • Designed for soldering electronic components and assemblies.
  • Suitable for use in various PCB and SMT applications.
  • Compatible with leaded and lead-free alloys.
  • Ideal for processes requiring easy water-based cleaning.

3. Typical Properties – Specifications

Property Test Method Results
IPC Flux Classification J-STD-004 / J-STD-004B ORM1
Copper Mirror Test IPC-TM-650 2.3.32 <50% Breakthrough
Corrosion Test IPC-TM-650 2.6.15 Minor
Quantitative Halides IPC-TM-650 2.3.28.1 0.07%
Qualitative Halides IPC-TM-650 2.3.33 Present
Fluoride Spot Test IPC-TM-650 2.3.35.1 No Fluoride
Surface Insulation Resistance (SIR) IPC-TM-650 2.6.3.7 PASS (Cleaned)
Acid Value IPC-TM-650 2.3.13 55.2 mg KOH/g
Flux Viscosity IPC-TM-650 2.4.34 600-1000 Kcps
Slump Resistance IPC-TM-650 2.4.35 PASS
Solder Ball Test IPC-TM-650 2.4.43 PASS
Tack Test IPC-TM-650 2.4.44 30.5 gf
Wetting IPC-TM-650 2.4.45 PASS
Visual Appearance J-STD-004B 3.4.2.5 Dark Brown

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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