WS488 is a water-soluble solder paste engineered for superior wetting on various electronic surfaces, components, and assemblies. It provides excellent print characteristics, extended stencil life (8+ hours), and robust environmental tolerance. WS488 is compatible with both leaded and lead-free alloys. Its residues are highly soluble and easily cleaned with plain water, making it a reliable choice for high-performance soldering applications.
| Property | Test Method | Results |
|---|---|---|
| IPC Flux Classification | J-STD-004 / J-STD-004B | ORM1 |
| Copper Mirror Test | IPC-TM-650 2.3.32 | <50% Breakthrough |
| Corrosion Test | IPC-TM-650 2.6.15 | Minor |
| Quantitative Halides | IPC-TM-650 2.3.28.1 | 0.07% |
| Qualitative Halides | IPC-TM-650 2.3.33 | Present |
| Fluoride Spot Test | IPC-TM-650 2.3.35.1 | No Fluoride |
| Surface Insulation Resistance (SIR) | IPC-TM-650 2.6.3.7 | PASS (Cleaned) |
| Acid Value | IPC-TM-650 2.3.13 | 55.2 mg KOH/g |
| Flux Viscosity | IPC-TM-650 2.4.34 | 600-1000 Kcps |
| Slump Resistance | IPC-TM-650 2.4.35 | PASS |
| Solder Ball Test | IPC-TM-650 2.4.43 | PASS |
| Tack Test | IPC-TM-650 2.4.44 | 30.5 gf |
| Wetting | IPC-TM-650 2.4.45 | PASS |
| Visual Appearance | J-STD-004B 3.4.2.5 | Dark Brown |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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