Item Number: SACX Plus 0307
Manufacturer: MacDermid Alpha®
Alloy/ Composition: Sn99 / Cu0.7 / Ag0.3 with proprietary micro-alloying (SACX Plus)
Diameter/ Size Range: Solid solder bar form
Flux Type/ Core: Not applicable (solid solder bar)
Melting Temperature: ~217–227 °C (typical for SnCuAg alloys)
Packaging: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Alpha SACX Plus 0307 Solid Solder Bar is a high-quality, lead-free solder alloy bar designed for reliable electronics assembly. It provides excellent wetting, consistent melting characteristics, and strong solder joint integrity. The alloy formulation ensures minimal dross formation, smooth flow, and high mechanical strength, delivering dependable performance in high-reliability applications.
SACX Plus 0307 solid solder bars are suitable for wave soldering, reflow, and general electronics soldering processes. They are particularly effective for high-volume production, fine-pitch components, and high-density PCBs where precise, consistent soldering is required.
Alloy Composition: SAC305 variant (Sn96.5/Ag3.0/Cu0.5) or SACX Plus 0307 specification
Melting Range: Approximately 217–220°C
Form: Solid solder bar
Residues: Minimal, non-corrosive, compatible with no-clean processes when used with flux
Mechanical Properties: High joint strength and reliability
Storage: Store in a cool, dry place to maintain alloy quality and prevent oxidation
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.