Item Number: Telecore HF-850
Manufacturer: MacDermid Alpha®
Alloy/ Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5) and other alloys available
Diameter/ Wire Gauge: Multiple diameters available (e.g., 0.25–1.6 mm typical)
Flux Type/ Core Type: Halogen-free, no-clean flux core
Melting Temperature: ~217–221 °C (SAC305)
Packaging: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Alpha Telecore HF-850 Solder Wire is a high-quality, lead-free solder wire engineered for reliable electronic assembly. It provides excellent wetting, consistent melting characteristics, and strong solder joint integrity. The alloy formulation minimizes dross formation and ensures smooth flow, delivering high mechanical strength and dependable performance in high-reliability applications.
HF-850 solder wire is suitable for surface mount technology (SMT), through-hole assembly, general electronics soldering, rework, and repair operations. It is particularly effective for fine-pitch components, high-density PCBs, and lead-free production lines that require precise soldering and consistent quality.
Alloy Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Melting Range: Approximately 217–220°C
Flux Core: Mildly activated, rosin-based flux suitable for no-clean applications
Diameter Options: Multiple diameters available for diverse soldering needs
Residues: Minimal, non-corrosive, compatible with no-clean processes
Mechanical Properties: High joint strength and reliability
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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Website: techniq.vn
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