Item Number: Telecore XL-825
Manufacturer: MacDermid Alpha®
Alloy/ Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5) and other alloys available
Diameter/ Wire Gauge: Multiple diameters available (e.g., 0.25–1.6 mm typical)
Flux Type/ Core Type: No-clean, halogen-free flux core
Melting Temperature: ~217–221 °C (SAC305)
Packaging: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Alpha Telecore XL-825 Solder Wire is a premium-quality, lead-free solder wire engineered for reliable electronics assembly. It provides superior wetting, consistent melting characteristics, and excellent solder joint integrity. The alloy is optimized for minimal dross formation, smooth flow, and high mechanical strength, ensuring dependable performance in high-reliability applications.
XL-825 solder wire is suitable for surface mount technology (SMT), through-hole assembly, general electronics soldering, rework, and repair operations. It is particularly effective for fine-pitch components, high-density PCBs, and lead-free production lines requiring precise soldering and consistent quality.
Alloy Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Melting Range: Approximately 217–220°C
Flux Core: Mildly activated, rosin-based flux suitable for no-clean applications
Diameter Options: Multiple diameters available for various soldering needs
Residues: Minimal, non-corrosive, compatible with no-clean processes
Mechanical Properties: High joint strength and reliability
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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