Item Number: WS-826
Manufacturer: MacDermid Alpha®
Lead Type: Lead-Free (RoHS compliant)
Alloys: SAC305 (others available)
Type: Water-soluble solder paste
Package: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Alpha WS-826 Solder Paste is a high-performance, no-clean solder paste designed for lead-free assembly processes. It delivers excellent wetting, superior solder joint formation, and consistent reliability across fine-pitch and high-density surface mount assemblies. The paste exhibits stable rheology, extended stencil life, and minimal, non-corrosive residues, making it ideal for advanced electronics manufacturing.
WS-826 is suitable for surface mount technology (SMT) applications, including BGAs, QFPs, and other fine-pitch components. It can be applied via stencil printing, syringe dispensing, and rework operations, providing precise and repeatable solder deposition. The paste is particularly effective in high-volume production where consistency and process control are critical.
Alloy Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Flux Type: No-clean, halogen-free
Viscosity: Optimized for stencil printing and dispensing
Residues: Minimal, non-corrosive, suitable for no-clean processes
Print Life: Extended stencil life under normal production conditions
Reflow Profile: Suitable for lead-free reflow temperature profiles
Storage: Refrigerated storage recommended to maintain paste consistency and performance
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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