• Item Name: ARALDITE® AW 4752 / HARDENER HW 4753
• Manufacturer: Huntsman
• Technologies: Two-component structural epoxy adhesive & gap-filling paste
• Color: Paste
• Cure Type: Room-temperature cure; full cure requires heat (≥60 °C)
• Package Size: Contact Techniq VN for details.
• Shelf Life: Contact Techniq VN for details.
ARALDITE® AW 4752 / HARDENER HW 4753 is a two-component epoxy paste adhesive designed for high-strength, tough, and chemically resistant bonding. It cures at room temperature and provides excellent performance at elevated temperatures and under aggressive environmental conditions. The system features controlled flow, good wettability, and long working life, making it suitable for industrial applications requiring durable joints. Its heat resistance up to 100°C and reliability in warm or chemically intense environments make it ideal for bonding hydraulic filters and metal assemblies.
Bonding hydraulic filters and filter components
Structural bonding of aluminium, steel, polyamides, fabrics, and treated metals
Industrial assembly requiring chemical and temperature resistance
Applications needing controlled-flow, gap-filling epoxy adhesive
Co-curing with phenolic-impregnated filter media
Before Mixing / Unmixed Components
| Property | Value | Notes |
|---|---|---|
| Physical form | Paste | Controlled-flow |
| Mix ratio (by weight) | 100 : 47 | Resin : Hardener |
| Mix ratio (by volume) | 100 : 50 | Resin : Hardener |
| Specific gravity | ~1.7 | — |
| Viscosity | ~30 Pa·s | — |
| Property | Value | Test Method / Notes |
|---|---|---|
| Tensile strength | 30 MPa | ISO 527, cured 16h/40°C |
| Shore hardness | 84 D | ISO 868 |
| E-modulus | 5.5 GPa | ISO 527 |
| Elongation at break | 0.7% | ISO 527 |
| Roller peel strength | 3 N/mm | ISO 4578 |
| Heat/cycle resistance | 14 MPa | After 100 cycles (-30°C to +70°C) |
| Minimum lap shear | ≥10 MPa | Internal, at 80°C |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.