Item Name: ARALDITE® CW 1305 / ARADUR® HY 5809
Manufacturer: Huntsman
Technologies: Epoxy & epoxy derivatives for composite materials
Color: Contact to Techniq VN for details.
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
ARALDITE® CW 1305 / ARADUR® HY 5809 is a hot-curing, filled epoxy casting and impregnating resin system. Designed for high-performance applications, it offers excellent electro-mechanical properties, chemical and moisture resistance, and good thermal endurance. The system is chemically inert toward sensitive substrates and meets UL 94 V-0 (4 mm) flammability standards. It is suitable for casting and vacuum pressure impregnation of heat-generating components in environments combining heat and corrosion.
Encapsulation of heat-evolving components
Impregnation of composites in heat and corrosive environments
Vacuum pressure casting for electronic and electrical units
High-performance insulation for heat-generating elements
| Property | Still Not Mixed | After Mixed / Cured | Unit | Test Method |
|---|---|---|---|---|
| Elongation at break | – | 1.1 | % | ISO 527 |
| Tensile Modulus | – | 7900 | MPa | ISO 527 |
| Tensile Strength | – | 67 | MPa | ISO 527 |
| Glass Transition Temperature | – | 130 | °C | ISO 11359 |
| Hardness | – | 88 | Shore D | ISO 868 |
| Thermal Conductivity | – | 1 | W/mK | ISO 8894-1 |
| Thermal Linear Coefficient | – | 40 | ppm/K | ISO 11359-2 |
| Dielectric Constant (50Hz, 25°C) | – | 5.2 | – | IEC 60250 |
| Dielectric Loss Factor (50Hz, 25°C) | – | 3.2 | % | IEC 60250 |
| Dielectric Strength (3 mm) | – | 22 | kV/mm | IEC 60243-1 |
| Volume Resistivity (25°C) | – | 10¹⁴ | Ω·cm | IEC 60093 |
| Flame Rating | – | V-0 | – | UL 94 BG E96722 |
| Thermal Class | – | F | – | IEC 60085 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.