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Thermal Management

Araldite® CY 221 / Aradur® HY 2966 – Epoxy Casting System – Encapsulation & Potting of Electronic Components

Item Name: Araldite® CY 221 Resin / Aradur® HY 2966 Hardener
Manufacturer: Huntsman Advanced Materials
Technologies: Low-viscosity, unfilled epoxy casting resin with formulated polyamine hardener
Color: Clear liquid (yellowish after cure)
Cure Type: Room temperature or 4 h at RT + 4 h at 60°C
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

Araldite® CY 221 / Aradur® HY 2966 is a low-viscosity, unfilled epoxy casting resin system designed for room-temperature curing with high filler loading capacity. The system offers excellent heat resistance, chemical and atmospheric durability, and good crack resistance, making it suitable for applications requiring both electrical insulation and structural resilience. The product is UL 94 HB (6 mm) rated for flammability.


2. Applications

This system is recommended for encapsulation and potting of low-voltage and electronic components. It is processed using casting and vacuum casting methods, ensuring bubble-free results and reliable insulation for sensitive electrical assemblies.

3. Typical Properties

Property Still Not Mixed (Resin / Hardener) After Mixed (Cured System)
Viscosity at 25°C (mPa·s) 355–475 / 300–600 490
Specific Gravity (g/cm³) 1.15 / 0.97
Appearance Clear liquid / Clear liquid Transparent to light yellow
Mix Ratio (pbw) Resin 100 / Hardener 25
Pot Life at 25°C (min) 117
Gel Time at 25°C (min) 120
Curing Cycle 24–48 h at RT or 4 h RT + 4 h at 60°C
Tensile Strength (MPa) 8
Elongation at Break (%) 60
Hardness (Shore D) 25
Glass Transition Temperature (°C) 29
Dielectric Strength (kV/mm) 36
Volume Resistivity (Ω·cm) 10¹⁴

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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