• Item Name: Araldite® DBF Resin / Aradur® HY 2966 Hardener
• Manufacturer: Huntsman Advanced Materials
• Technologies: Low-viscosity, unfilled epoxy casting resin system with polyamine hardener
• Color: Clear liquid (yellow after cure)
• Cure Type: Room temperature or 4 h at RT + 4 h at 60°C
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
Araldite® DBF / Aradur® HY 2966 is a low-viscosity, unfilled epoxy casting resin system designed for room temperature curing. The system enables high filler addition, good heat resistance, and strong atmospheric and chemical durability. It consists of a plasticized epoxy resin (Araldite DBF) and a formulated polyamine hardener (Aradur HY 2966).
This resin system is primarily used for encapsulation and potting of low-voltage electrical and electronic components. It is suitable for casting and vacuum casting processes, offering reliability in electrical insulation and mechanical protection of sensitive components.
| Property | Still Not Mixed (Resin / Hardener) | After Mixed (Cured System) |
|---|---|---|
| Viscosity at 25°C (mPa·s) | 1350–2000 / 300–600 | 1500 |
| Specific Gravity (g/cm³) | 1.15 / 0.97 | 1.1 |
| Appearance | Clear liquid / Clear liquid | Yellow casting |
| Mix Ratio (pbw) | Resin 100 / Hardener 25 | — |
| Pot Life at 25°C (min) | — | 35–56 |
| Gel Time (25°C, min) | — | 42 |
| Curing Cycle | — | 24–48 h at RT or 4 h RT + 4 h at 60°C |
| Flexural Strength (MPa) | — | 112 |
| Hardness (Shore D) | — | 80 |
| Tensile Strength (MPa) | — | 61 |
| Glass Transition Temperature (°C) | — | 54 |
| Dielectric Strength (kV/mm) | — | 24 |
| Volume Resistivity (Ω·cm) | — | 8 × 10¹⁵ |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.