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Thermal Management

Araldite DBF / Aradur HY 2967 – Epoxy Casting System – Potting and Encapsulation Electronics

Item Name: Araldite® DBF Resin / Aradur® HY 2967 Hardener
Manufacturer: Huntsman Advanced Materials
Technologies: Low-viscosity, unfilled epoxy casting resin system with high filler loading capability
Color: Clear liquid (resin and hardener); cured casting yellow-brown
Cure Type: Room temperature (24–48 h) or accelerated (4 h at 40°C / 2 h at 60°C)
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

Araldite® DBF combined with Aradur® HY 2967 is a low-viscosity, unfilled epoxy casting system designed for room temperature curing. It offers high filler acceptance, good heat resistance, and strong resistance to atmospheric and chemical degradation. The system ensures excellent encapsulation performance for electrical and electronic applications.


2. Applications

  • Encapsulation and potting of low-voltage and electronic components

  • Suitable for casting and vacuum casting methods

  • Recommended for use where moderate thermal and electrical insulation properties are required

3. Typical Properties

Property Araldite® DBF (Resin) Aradur® HY 2967 (Hardener) Mixed System (Cured)
Appearance Clear liquid Clear liquid Yellow-brown solid
Viscosity (25°C) 1350–2000 mPa·s 2900–3700 mPa·s 2400 mPa·s
Specific Gravity 1.1–1.2 g/cm³ 0.99 g/cm³
Epoxy/Amine Equivalent 4.15–4.35 Eq/kg
Mix Ratio (pbw) 100 35
Pot Life (25°C) ~50 min (to 15000 mPa·s)
Gel Time 60 min (25°C); 30 min (40°C); 10 min (60°C)
Minimum Curing 24–48 h at RT / 4 h at 40°C / 2 h at 60°C
Glass Transition Temp. 54 °C
Tensile Strength 50 MPa
Elongation at Break 10 %
Tensile Modulus 2500 MPa
Hardness Shore D 80
Dielectric Strength 17 kV/mm
Dielectric Constant (50 Hz, 25°C) 4.1
Volume Resistivity 10¹⁵ Ω·cm
Water Absorption 0.3% (23°C, 10 days) / 0.2% (100°C, 30 min)

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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