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Thermal Management

Arathane XW 949-1 / Arathane HY 5610 – Polyurethane Casting System – Pressure Sensitive Devices

Item Name: Arathane® XW 949-1 Resin / Arathane® HY 5610 Hardener
Manufacturer: Huntsman Advanced Materials
Technologies: Halogen-free, unfilled polyurethane casting system for room temperature curing
Color: XW 949-1 – blue liquid, HY 5610 – brown liquid
Cure Type: Room temperature (24 h) or accelerated (6 h at 80°C)
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

Arathane® XW 949-1 with HY 5610 is a polyurethane, halogen-free, unfilled casting system designed for room temperature processing and curing. It provides flexibility and is particularly suitable for pressure-sensitive devices. The system offers excellent dielectric properties, strong resistance to thermal shock, and a low glass transition temperature, making it highly reliable for electronic encapsulation and protection applications.


2. Applications

  • Pressure-sensitive devices

  • Electronic modules

  • Proximity switches

  • Suitable for manual casting or automated mixing/dosing systems

3. Typical Properties

Property XW 949-1 (Polyol, not mixed) HY 5610 (Isocyanate, not mixed) After Mixed & Cured
Appearance Blue liquid Brown liquid Solid flexible polyurethane
Viscosity 4000–7000 mPa·s (20°C) 80–120 mPa·s (25°C) ~1800 mPa·s (25°C)
Specific Gravity 0.91 g/cm³ 1.23 g/cm³
Mix Ratio 100:50 (by weight)
Gel Time ~50 min (25°C)
Pot Life ~17 min (25°C)
Minimum Cure Cycle 24 h at RT or 6 h at 80°C
Glass Transition Temp -62 °C
Mechanical Strength Tensile: 4.3 MPa; Elongation: 37%
Electrical Properties Dielectric Strength: 26.1 kV/mm; Volume Resistivity: 4.9×10¹⁵ Ω·cm

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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