Applications

BERGQUIST BOND PLY TBP 800

  • Item Name: BERGQUIST BOND PLY TBP 800
  • Manufacturer: Henkel
  • Product Category: Thermally conductive adhesive tape
  • Technologies: Acrylic-based, fiberglass-reinforced, double-sided pressure-sensitive adhesive
  • Applications: Mount LED assembly to troffer housing, heat sink, power converter PCB, motor control PCB, BGA graphic processor
  • Color: Gray
  • Cure Type: Pressure-sensitive adhesive (PSA)
  • Package Size: Contact Techniq VN for details
  • Shelf Life: Contact Techniq VN for details

1. Product Overview

BERGQUIST BOND PLY TBP 800 is a thermally conductive, fiberglass-reinforced, pressure-sensitive adhesive tape designed for thermal management applications. It provides high bond strength, electrical isolation, and thermal transfer while eliminating the need for mechanical fasteners or heat-cure adhesives.

Key Features & Benefits:

  • Thermal impedance: 0.6°C-in²/W @ 50 psi
  • High bond strength to most epoxies and metals
  • Double-sided, pressure-sensitive adhesive tape
  • Electrically isolating and flame retardant (UL 94 V-0)
  • Cost-effective alternative to screws, clips, and heat-cure adhesives
  • Operating temperature range: -40 to 125°C

2. Applications

  • Mounting LED assemblies to troffer housing and heat sinks
  • Attaching heat spreaders to power converter PCBs or motor control PCBs
  • Securing heat sinks to BGA graphic processors or drive processors

3. Typical Properties

Physical Properties

Property Test Method Value
Elongation (% at 45° to warp and fill) ASTM D412 70
Coefficient of Thermal Expansion (ppm/°C) ASTM D3386 600
Flammability Rating UL 94 V-0
Tensile Strength (MPa) ASTM D412 10 (1,500 psi)

Adhesion Properties

Property Test Method Value
Lap Shear Strength @ 25°C (MPa) ASTM D1002 1.0 (150 psi)

Electrical Properties

Property Test Method Value
Dielectric Breakdown Voltage @ 0.005″ (Vac) ASTM D149 4,000
Dielectric Breakdown Voltage @ 0.008″ (Vac) ASTM D149 6,000
Dielectric Constant @ 1,000 Hz ASTM D150 4.0
Volume Resistivity (ohm-meter) ASTM D257 1×10¹¹

Thermal Properties

Property Test Method Value
Thermal Conductivity (W/m-K) ASTM D5470 0.8

Thermal Performance (TO-220, °C/W)

Pressure (psi) @ 0.005″ @ 0.008″
10 5.0 6.2
25 5.0 6.0
50 4.8 5.6
100 4.3 5.3
200 4.2 5.2

Thermal Impedance (°C-in²/W, ASTM D5470)

Pressure (psi) @ 0.005″ @ 0.008″
10 0.63 0.78
25 0.62 0.74
50 0.60 0.72
100 0.58 0.71
200 0.57 0.71

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