BERGQUIST BOND PLY TBP 800 is a thermally conductive, fiberglass-reinforced, pressure-sensitive adhesive tape designed for thermal management applications. It provides high bond strength, electrical isolation, and thermal transfer while eliminating the need for mechanical fasteners or heat-cure adhesives.
Key Features & Benefits:
| Property | Test Method | Value |
|---|---|---|
| Elongation (% at 45° to warp and fill) | ASTM D412 | 70 |
| Coefficient of Thermal Expansion (ppm/°C) | ASTM D3386 | 600 |
| Flammability Rating | UL 94 | V-0 |
| Tensile Strength (MPa) | ASTM D412 | 10 (1,500 psi) |
| Property | Test Method | Value |
|---|---|---|
| Lap Shear Strength @ 25°C (MPa) | ASTM D1002 | 1.0 (150 psi) |
| Property | Test Method | Value |
|---|---|---|
| Dielectric Breakdown Voltage @ 0.005″ (Vac) | ASTM D149 | 4,000 |
| Dielectric Breakdown Voltage @ 0.008″ (Vac) | ASTM D149 | 6,000 |
| Dielectric Constant @ 1,000 Hz | ASTM D150 | 4.0 |
| Volume Resistivity (ohm-meter) | ASTM D257 | 1×10¹¹ |
| Property | Test Method | Value |
|---|---|---|
| Thermal Conductivity (W/m-K) | ASTM D5470 | 0.8 |
| Pressure (psi) | @ 0.005″ | @ 0.008″ |
|---|---|---|
| 10 | 5.0 | 6.2 |
| 25 | 5.0 | 6.0 |
| 50 | 4.8 | 5.6 |
| 100 | 4.3 | 5.3 |
| 200 | 4.2 | 5.2 |
| Pressure (psi) | @ 0.005″ | @ 0.008″ |
|---|---|---|
| 10 | 0.63 | 0.78 |
| 25 | 0.62 | 0.74 |
| 50 | 0.60 | 0.72 |
| 100 | 0.58 | 0.71 |
| 200 | 0.57 | 0.71 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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