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Thermal Management

BERGQUIST BOND PLY TBP 800 – Adhesive Tape – Thermal Management & Electronics

  • Item Name: BERGQUIST BOND PLY TBP 800
  • Manufacturer: Henkel
  • Technologies: Acrylic-based, Fiberglass Reinforced, Pressure Sensitive Adhesive Tape
  • Color: Gray
  • Cure Type: Pressure sensitive adhesive (no curing required)
  • Package Size: Contact to Techniq VN for details.
  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

BERGQUIST BOND PLY TBP 800 is a fiberglass-reinforced, thermally conductive, electrically isolating, double-sided acrylic adhesive tape. It provides high bond strength to most epoxies and metals while eliminating the need for mechanical fasteners or high-temperature curing.

2. Applications

  • Mounting LED assemblies to troffer housing or heat sinks
  • Attaching heat spreaders onto power converter or motor control PCBs
  • Mounting heat sinks onto BGA graphic processors or drive processors

3. Typical Properties

Property Value
Technology Acrylic
Appearance Gray
Reinforcement Carrier Fiberglass
Total Thickness 0.005″ (0.127mm) / 0.008″ (0.203mm)
Operating Temperature Range -40 to 125°C
Thermal Conductivity 0.8 W/m-K
Dielectric Breakdown Voltage 4,000V (0.005″) / 6,000V (0.008″)
Volume Resistivity 1×10¹¹ ohm-meter
Flammability Rating UL 94 V-0
Lap Shear Strength 1.0 MPa (150 psi)

Features & Benefits

  • High bond strength to most epoxies and metals
  • Eliminates the need for screws, clips, or heat-cure adhesives
  • Cost-effective thermal management solution
  • Reliable adhesion with ambient temperature processing

Configurations Available

  • Supplied in sheets, rolls, or die-cut parts

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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