Applications

BERGQUIST BOND PLY TBP 850 (Known as BERGQUIST BOND-PLY 100)

  • Item Name: BERGQUIST BOND PLY TBP 850 (Known as BERGQUIST BOND-PLY 100)
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Adhesive Tape
  • Technologies: Acrylic, Fiberglass Reinforced Pressure Sensitive Adhesive
  • Applications: Mount heat sinks onto BGA graphics processors, drive processors, power converters, and motor control PCBs.
  • Color: White
  • Cure Type: Pressure-sensitive adhesive
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 12 months from the date of manufacture at a max storage temperature of 60°C.

 

 

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1. Product Overview

BERGQUIST BOND PLY TBP 850 (also known as BERGQUIST BOND-PLY 100) is a thermally conductive, fiberglass-reinforced, pressure-sensitive adhesive tape. It provides high bond strength and is designed to efficiently transfer heat while offering easy application due to its double-sided adhesive nature.

Key Features & Benefits:

  • Thermal impedance: 0.52°C-in²/W @ 50 psi
  • High bond strength to multiple surfaces
  • Double-sided, pressure-sensitive adhesive
  • Eliminates the need for heat-cure adhesive, screws, or clips
  • Operating Temperature Range: -40 to 120ºC

2. Applications

Mounting heat sinks onto BGA graphic processors and drive processors
Mounting heat spreaders onto power converter PCBs or motor control PCBs

3. Typical Properties

Physical Properties

Property Test Method Value
Total Thickness (mm) ASTM D374 0.127, 0.203, 0.279
Temperature Coefficient of Resistance (°C) 200
Elongation (%) ASTM D412 70
Coefficient of Thermal Expansion (ppm) ASTM D3386 325
Glass Transition Temperature (°C) ASTM D1356 -30
Flammability Rating UL 94 V-0
Tensile Strength (MPa) ASTM D412 6 (900 psi)

Adhesion Properties

Property Test Method Value
Lap Shear Strength @ 25°C (MPa) ASTM D1002 0.7 (100 psi)
After 5 hours @ 100°C (MPa) ASTM D1002 1.4 (200 psi)
After 2 minutes @ 200°C (MPa) ASTM D1002 1.4 (200 psi)
Static Dead Weight Shear Strength (°C) PSTC#7 150

Electrical Properties

Property Test Method Value
Dielectric Breakdown Voltage @ 0.005″ (Vac) ASTM D149 3,000
Dielectric Breakdown Voltage @ 0.008″ (Vac) ASTM D149 6,000
Dielectric Breakdown Voltage @ 0.011″ (Vac) ASTM D149 8,500

Thermal Properties

Property Test Method Value
Thermal Conductivity (W/m-K) ASTM D5470 0.8

Thermal Impedance vs. Pressure

Thickness Pressure (psi) TO-220 Thermal Performance (°C/W) Thermal Impedance (°C-in²/W)
0.005″ 10 5.17 0.56
25 4.87 0.54
50 4.49 0.52
100 4.18 0.50
200 4.10 0.50
0.008″ 10 5.4 0.82
25 5.35 0.80
50 5.28 0.78
100 5.22 0.77
200 5.20 0.75
0.011″ 10 6.59 1.03
25 6.51 1.02
50 6.51 1.01
100 6.50 1.00
200 6.40 0.99

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