BERGQUIST GAP FILLER TGF 1000 is a thermally conductive, liquid gap filler designed for fragile and low-stress applications. It is a two-component system that cures at room or elevated temperatures, forming a soft, thermally conductive, form-in-place elastomer.
✔ Thermal Conductivity: 1.0 W/m-K
✔ Ultra-conforming with minimal stress during application
✔ Room temperature or accelerated cure schedules
✔ 100% solids with no cure by-products
✔ Excellent mechanical and chemical stability across a wide temperature range
🔹 Automotive electronics (HEV, NEV, battery applications)
🔹 Computers & peripherals
🔹 Heat-generating semiconductors to heat sinks
🔹 Telecommunications
🔹 Vibration dampening with thermal conductivity
| Property | Value | Test Method |
|---|---|---|
| Appearance (Part A) | Gray | – |
| Appearance (Part B) | White | – |
| Mix Ratio (by weight & volume) | 1:1 | – |
| Solids Content | 100% | – |
| Operating Temperature Range | -60 to 175°C | – |
| Property | Value | Test Method |
|---|---|---|
| Viscosity @ 25°C | 100,000 mPa·s | ASTM D2196 |
| Density | 1.6 g/cc | ASTM D792 |
| Pot Life @ 25°C | 15 minutes | – |
| Shelf Life @ 25°C | 180 days | – |
| Temperature | Time |
|---|---|
| 25°C | 60 – 120 min |
| 100°C | 5 min |
| Property | Value | Test Method |
|---|---|---|
| Hardness (Shore 00) | 20 | ASTM D2240 |
| Thermal Conductivity | 1.0 W/m-K | ASTM D5470 |
| Heat Capacity | 1.0 J/g-K | ASTM E1269 |
| Flammability Rating | UL 94 V-0 | – |
| Dielectric Strength | 500 V/mil | ASTM D149 |
| Volume Resistivity | 1×10¹¹ ohm-cm | ASTM D257 |
| Dielectric Constant @ 1,000 Hz | 5.0 | ASTM D150 |
🔹 Storage: Keep in a dry, unopened container at 5 – 25°C for up to 6 months.
🔹 Packaging:
✔ Cartridges
✔ Kits
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