Products

BERGQUIST GAP FILLER TGF 1000SR

– Item Name: BERGQUIST GAP FILLER TGF 1000SR
– Manufacturer: Henkel
– Product Category: Thermally Conductive Liquid Gap Filler
– Technologies: Silicone-based, thermally conductive, two-part liquid gap filler
– Applications: Automotive electronics (HEV, NEV, batteries), computer peripherals, semiconductor and heat sink interface, telecommunications
– Color: Part A: Violet, Part B: White, Cured: Violet
– Cure Type: Room temperature cure or heat cure
– Package Size: Contact Techniq VN for details.
– Shelf Life: 6 months

 

 

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1. Product Overview

BERGQUIST GAP FILLER TGF 1000SR is a two-part, thermally conductive liquid gap filler designed for superior slump resistance. It cures at room temperature or can be heat-accelerated, forming a soft, thermally conductive elastomer. The material provides excellent conformability for low-stress applications and does not produce cure by-products.

Key Features & Benefits:

  • Thermal conductivity: 1.0 W/m-K
  • Excellent slump resistance (stays in place)
  • Ultra-conforming for delicate components
  • 100% solids, no cure by-products
  • Operates in temperatures from -60°C to 175°C
  • Low natural tack, non-structural bonding

2. Applications

  • Automotive electronics (HEV, NEV, batteries)
  • Computer & peripherals
  • Telecommunications
  • Between heat-generating components & heat sinks

3. Typical Properties

Before Mixing (Uncured Material)

Property Test Method Value
Viscosity @ 4,500 s⁻¹ ASTM D5099 20,000 mPa·s (cP)
Density ASTM D792 2.0 g/cc
Mix Ratio (by weight & volume) 1:1
Pot Life @ 25°C ARES Rheometer 60 min
Shelf Life @ 25°C 180 days

Curing Schedule

Temperature Time
Room Temp (25°C) 20 hours
Heat Cure (100°C) 10 minutes

After Curing (Cured Material)

Property Test Method Value
Hardness (Shore 00) ASTM D2240 75
Heat Capacity ASTM E1269 1.0 J/g-K
Flammability UL 94 V-0

Electrical Properties

Property Test Method Value
Dielectric Strength ASTM D149 500 V/mil
Dielectric Constant (1,000 Hz) ASTM D150 5.1
Volume Resistivity ASTM D257 1×10¹¹ ohm-meter

Thermal Properties

Property Test Method Value
Thermal Conductivity ASTM D5470 1.0 W/m-K

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