BERGQUIST GAP FILLER TGF 1000SR is a two-part, thermally conductive liquid gap filler designed for superior slump resistance. It cures at room temperature or can be heat-accelerated, forming a soft, thermally conductive elastomer. The material provides excellent conformability for low-stress applications and does not produce cure by-products.
Key Features & Benefits:
| Property | Test Method | Value |
|---|---|---|
| Viscosity @ 4,500 s⁻¹ | ASTM D5099 | 20,000 mPa·s (cP) |
| Density | ASTM D792 | 2.0 g/cc |
| Mix Ratio (by weight & volume) | – | 1:1 |
| Pot Life @ 25°C | ARES Rheometer | 60 min |
| Shelf Life @ 25°C | – | 180 days |
| Temperature | Time |
|---|---|
| Room Temp (25°C) | 20 hours |
| Heat Cure (100°C) | 10 minutes |
| Property | Test Method | Value |
|---|---|---|
| Hardness (Shore 00) | ASTM D2240 | 75 |
| Heat Capacity | ASTM E1269 | 1.0 J/g-K |
| Flammability | UL 94 | V-0 |
| Property | Test Method | Value |
|---|---|---|
| Dielectric Strength | ASTM D149 | 500 V/mil |
| Dielectric Constant (1,000 Hz) | ASTM D150 | 5.1 |
| Volume Resistivity | ASTM D257 | 1×10¹¹ ohm-meter |
| Property | Test Method | Value |
|---|---|---|
| Thermal Conductivity | ASTM D5470 | 1.0 W/m-K |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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