Industries

BERGQUIST GAP FILLER TGF 1100SF

  • Item Name: BERGQUIST GAP FILLER TGF 1100SF
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Gap Filler
  • Technologies: Silicone-free, liquid gap filler, thermally conductive
  • Applications: Hard disk assemblies, silicone-sensitive electronics, heat sink interfaces, relays, optical components, dielectric for bare-leaded devices.
  • Color: Part A: Yellow, Part B: Red, Cured: Orange
  • Cure Type: Room temperature or heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 6 months

BERGQUIST GAP FILLER TGF 1100SF – Summary

Thermally Conductive, Silicone-Free Gap Filling Material

1. Product Overview

BERGQUIST GAP FILLER TGF 1100SF is a high-performance, thermally conductive, liquid gap-filling material that cures into a soft elastomer. It is silicone-free, ultra-conforming, and designed for fragile and low-stress applications. The product cures at ambient or elevated temperatures, providing excellent thermal performance without silicone outgassing.

Key Features:

  • Thermal Conductivity: 1.1 W/m-K
  • No silicone outgassing or extraction
  • Low modulus, reducing thermal cycling stress
  • 100% solids, no cure by-products
  • Available in fast cure (15 min pot life) and slow cure (240 min pot life) versions

2. Applications

  • Hard disk assemblies
  • Silicone-sensitive electronics
  • Heat dissipation between components and heat sinks
  • Mechanical switching relays
  • Optical components
  • Dielectric applications for bare-leaded devices

3. Typical Properties

Uncured Properties

Property Part A Part B Mixed
Color Yellow Red Orange (cured)
Density (g/cc) 2.0
Viscosity @ 25°C (mPa·s) 1.0 1.0 450,000
Pot Life @ 25°C (minutes) 15 (Fast) / 240 (Slow)
Shelf Life @ 25°C (days) 180

Cured Properties

Property Value Test Method
Hardness (Shore 00) 60 ASTM D2240
Heat Capacity (J/g-K) 0.9 ASTM E1269
Flammability UL 94 V-0
Dielectric Strength (V/mil) 400 ASTM D149
Dielectric Constant (@1,000 Hz) 5.0 ASTM D150
Volume Resistivity (ohm-cm) 1×10¹⁰ ASTM D257
Thermal Conductivity (W/m-K) 1.1 ASTM D5470

Cure Schedule

Condition TGF 1100SF-15 (Fast) TGF 1100SF-240 (Slow)
Work Life (minutes) 15 240
Cure Time @ 25°C 3 hours 24 hours
Cure Time @ 100°C 20 minutes 120 minutes

Storage & Handling

  • Store in a dry location at 5 to 25°C for up to 6 months in sealed containers.
  • Use dual-tube cartridges with static mixers for dispensing.
  • Heat may be applied to reduce viscosity during application.

RELATED PRODUCT

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.