Industries

BERGQUIST GAP FILLER TGF 1400SL

  • Item Name: BERGQUIST GAP FILLER TGF 1400SL
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Gap Filler
  • Technologies: Silicone-based, liquid gap filling material
  • Applications: Automotive electronics, telecommunications, semiconductor encapsulation, power supplies, lighting, and silicone-sensitive applications
  • Color: Yellow (cured), Yellow (Part A), White (Part B)
  • Cure Type: Room temperature cure (24h @ 25°C) or Heat cure (30min @ 100°C)
  • Package Size: Kits (1,200cc), Pail (7-gallon)
  • Shelf Life: 6 months

1. Product Overview

BERGQUIST GAP FILLER TGF 1400SL is a two-part, thermally conductive, silicone-based liquid gap filler with extremely low viscosity. It provides excellent thermal transfer, self-leveling properties, and a soft, vibration-dampening cured form. This material is designed for use in applications requiring thermal interface materials (TIM) with minimal stress to components.

Key Features:

  • Thermal Conductivity: 1.4 W/m-K
  • Self-leveling and very soft
  • Vibration dampening
  • Low natural tack (not for structural bonding)

2. Applications

  • Automotive electronics (HEV, NEV, battery systems)
  • Telecommunications
  • Encapsulation of semiconductors & magnetic components with heatsinks
  • Silicone-sensitive applications
  • Lighting
  • Power supplies

3. Typical Properties

Uncured Material

Property Value Test Standard
Mixed Viscosity 5,000 mPa·s (cP) ASTM D2196
Density 2.5 g/cc ASTM D792
Working Time (@25°C) 120 minutes
Shelf Life (@25°C) 180 days

Cure Schedule

Cure Condition Time
Room Temperature Cure 24 hours @ 25°C
Heat Cure 30 minutes @ 100°C

Cured Material

Property Value Test Standard
Hardness (Shore 00) 40 ASTM D2240
Heat Capacity 0.9 J/g-K ASTM E1269
Flammability Rating V-0 UL 94
Siloxane Content (ΣD4-D10) 40 ppm

Electrical Properties

Property Value Test Standard
Dielectric Strength 250 V/mil ASTM D149
Dielectric Constant (@1,000 Hz) 6.0 ASTM D150
Volume Resistivity 1×10¹¹ ohm-meter ASTM D257

Thermal Properties

Property Value Test Standard
Thermal Conductivity 1.4 W/(m-K) ASTM D5470

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