1. Product Overview

BERGQUIST GAP FILLER TGF 1450 is a two-part, high-performance, thermally conductive liquid gap filler designed for thermal management applications. It features a shear-thinning viscosity for easy dispensing and offers low stress on sensitive components. The material cures at room temperature or can be accelerated with heat curing.

Key Features & Benefits:

• Thermal conductivity: 1.5 W/m-K
• Ultra-conforming with excellent wet-out for near-zero interface stress
• No cure by-products
• Low density, ideal for weight-sensitive applications
• High-temperature stability from -60°C to 175°C
• Flame retardant (UL 94 V-0)
• Available with or without glass beads

2. Applications

• Automotive electronics (HEV, NEV, batteries)
• Lighting
• General thermal interface applications requiring high-performance gap filling