Industries

BERGQUIST GAP FILLER TGF 2000

  • Item Name: BERGQUIST GAP FILLER TGF 2000
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Gap Filler
  • Technologies: Silicone-based, thermally conductive, liquid gap filler
  • Applications: Automotive electronics, telecommunications, computers, thermal interface for heat dissipation
  • Color: Pink (cured), Part A (Pink), Part B (White)
  • Cure Type: Room temperature cure or heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 6 months

1. Product Overview

BERGQUIST GAP FILLER TGF 2000 is a thermally conductive, two-component liquid gap filler designed for thermal management applications. It offers excellent thermal conductivity (2.0 W/m-K) while remaining soft and pliable after curing, making it ideal for fragile or low-stress electronic applications. The material cures at room temperature or elevated temperatures and provides excellent mechanical and chemical stability across a wide temperature range (-60 to 200°C).


2. Applications

  • Automotive electronics (HEV, NEV, battery applications)
  • Telecommunications
  • Computers and peripherals
  • Thermally conductive vibration dampening
  • Thermal interface between heat-generating semiconductors and heat sinks

3. Typical Properties

Uncured Material Properties

Property Value Test Method
Appearance (Part A) Pink
Appearance (Part B) White
Mix Ratio (by weight & volume) 1:1
Mixed Viscosity @ 25°C 300,000 mPa·s (cP) ASTM D2196
Density 2.9 g/cc ASTM D792
Pot Life @ 25°C 15 – 600 min
Shelf Life @ 25°C 180 days

Cure Schedule

Cure Condition Time
25°C 1 to 2 hours
100°C 5 minutes
Alternative 1 (25°C) 3 to 4 hours
Alternative 1 (100°C) 15 minutes
Alternative 2 (25°C) 3 days
Alternative 2 (100°C) 1 hour

Cured Material Properties

Property Value Test Method
Hardness (Shore 00) 70 ASTM D2240
Heat Capacity 1.0 J/g-K ASTM E1269
Flammability UL 94 V-0

Electrical Properties

Property Value Test Method
Dielectric Strength 500 V/mil ASTM D149
Dielectric Constant @ 1,000 Hz 7 ASTM D150
Volume Resistivity 1×10¹¹ ohm-meter ASTM D257

Thermal Properties

Property Value Test Method
Thermal Conductivity 2.0 W/m-K ASTM D5470

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