BERGQUIST® GAP FILLER TGF 2900LVO is a 2-part, silicone-based, thermally conductive gap filler designed for electronic assembly applications. It features low volatile outgassing (LVO), excellent slump resistance, and outstanding dispensing behavior. With a thermal conductivity of 2.9 W/(m.K) and an ability to achieve ultra-thin bondline thickness, it is suitable for high-performance thermal management.
Key Benefits:
Curing Options:
| Property | Part A | Part B |
|---|---|---|
| Appearance | Blue | White |
| Viscosity (Low shear, 1.0 s⁻¹), Pa·s | 1,300 | 1,300 |
| Viscosity (High shear, 1,500 s⁻¹), Pa·s | 54 | 51 |
| Shelf Life @ 25°C | 270 days | 270 days |
| Property | Value |
|---|---|
| Mix Ratio (Weight & Volume) | 1:1 |
| Bondline Thickness | 35 µm |
| Density (ASTM D792) | 2.97 g/cc |
| Working Time @ 25°C | 120 min |
| Working Time @ 40°C | 20 min |
| Temperature | Cure Time |
|---|---|
| 25°C | 12 hours |
| 40°C | 180 minutes |
| 100°C | < 5 minutes |
| Property | Value |
|---|---|
| Hardness (Shore 00, ASTM D2240) | 55 |
| Heat Capacity (ASTM D1269) | 0.94 J/(g.K) |
| Flammability (UL 94) | V-0 |
| Property | Value |
|---|---|
| Dielectric Constant (ASTM D150 @ 0.1-20 GHz) | 6.78 |
| Volume Resistivity (ASTM D257) | 1×10¹⁰ Ω.m |
| Dielectric Strength (ASTM D149) | > 9 kV/mm |
| Property | Value |
|---|---|
| Thermal Conductivity (ASTM D5470) | 2.9 W/(m.K) |
| Thermal Resistance @ 0.2 mm | 1.2 (K.cm²)/W |
| Thermal Resistance @ 1.0 mm | 3.7 (K.cm²)/W |
| Thermal Resistance @ 2.0 mm | 7.2 (K.cm²)/W |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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