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BERGQUIST GAP FILLER TGF 3600 – Thermally Conductive Gap Filler – Electronics and Power Module Thermal Management

– Item Name: BERGQUIST GAP FILLER TGF 3600 (Known as BERGQUIST GAP FILLER 3500S35)
– Manufacturer: Henkel
– Product Category: Thermal Interface Material (TIM), Liquid Gap Filler
– Technologies: Silicone-based, Two-component liquid gap filler
– Applications: Automotive electronics (HEV, NEV, batteries), PCBA to housing, Discrete components to housing, Fiber optic telecommunications equipment
– Color: Blue (Cured), White (Part A), Blue (Part B)
– Cure Type: Room temperature cure or heat cure
– Package Size: Contact Techniq VN for details.
– Shelf Life: 5 months

1. Product Overview:

  • Product Name: BERGQUIST GAP FILLER TGF 3600 (also known as BERGQUIST GAP FILLER 3500S35)
  • Technology: Silicone
  • Appearance (Cured): Blue
  • Appearance (Part A): White
  • Appearance (Part B): Blue
  • Cure Type: Room temperature cure or heat cure
  • Mix Ratio by Weight: 1:1
  • Mix Ratio by Volume: 1:1
  • Operating Temperature Range: -60 to 200ºC

2. Applications:

  • Thermal Management
  • Thermal Interface Material (TIM)
  • Automotive Electronics (HEV, NEV, batteries)
  • PCBA to Housing
  • Discrete Components to Housing
  • Fiber Optic Telecommunications Equipment

3. Typical Properties – Uncured and Cured (Table Form):

Property Value
Mixed Viscosity (Brookfield) 150,000 mPa·s (cP)
Density 3.0 g/cc
Pot Life @ 25°C 60 minutes
Shelf Life @ 25°C 150 days
Hardness (Shore 00) 35
Flammability UL 94 V-0
Dielectric Strength 275 V/mil
Dielectric Constant 8.0 (ASTM D150 @ 1,000 Hz)
Volume Resistivity 1×10⁸ ohm-meter
Thermal Conductivity 3.6 W/(m-K)

4. Cure Schedule:

  • Room Temperature Cure: 15 hours @ 25°C
  • Accelerated Cure: 30 minutes @ 100°C

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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