BERGQUIST GAP FILLER TGF 4000 is a high thermal conductivity (4.0 W/m-K), two-part, liquid gap filler designed for thermal management applications. It cures at room temperature or with heat acceleration and maintains excellent mechanical and chemical stability over a wide temperature range (-60°C to 200°C). This silicone-based material is soft, ultra-conforming, and ideal for applications where a strong structural bond is not required but effective heat dissipation is essential.
| Property | Value | Test Method |
|---|---|---|
| Viscosity (1,500/sec), Part A & B | 50,000 mPa·s (cP) | ASTM D5099 |
| Density | 3.1 g/cc | ASTM D792 |
| Working Time @ 25°C | 240 minutes | – |
| Shelf Life @ 25°C | 150 days | – |
| Cure Condition | Time |
|---|---|
| 25°C | 24 hours |
| 100°C | 30 minutes |
| Property | Value | Test Method |
|---|---|---|
| Hardness (Shore 00) | 75 | ASTM D2240 |
| Heat Capacity | 0.8 J/g-K | ASTM E1269 |
| Flammability | UL 94 V-0 | – |
| Property | Value | Test Method |
|---|---|---|
| Dielectric Strength | 450 V/mil | ASTM D149 |
| Dielectric Constant @ 1,000 Hz | 7.9 | ASTM D150 |
| Volume Resistivity | 1×10¹⁰ ohm-meter | ASTM D257 |
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 4.0 W/m-K | ASTM D5470 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.