Industries

Automotive
Composites
Electronics Assembly
General Industries
Home Appliances
Medical Device

BERGQUIST® GAP FILLER TGF 4000 – Silicone-Based Liquid Gap Filler – Automotive electronics, computers, telecommunications

  • Item Name: BERGQUIST GAP FILLER TGF 4000
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Gap Filler
  • Technologies: Silicone-based, thermally conductive, liquid gap filler
  • Applications: Automotive electronics, computers, heat sink interface, telecommunications
  • Color: Blue (cured), Part A (Blue), Part B (White)
  • Cure Type: Room temperature cure or heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 5 months

1. Product Overview

BERGQUIST GAP FILLER TGF 4000 is a high thermal conductivity (4.0 W/m-K), two-part, liquid gap filler designed for thermal management applications. It cures at room temperature or with heat acceleration and maintains excellent mechanical and chemical stability over a wide temperature range (-60°C to 200°C). This silicone-based material is soft, ultra-conforming, and ideal for applications where a strong structural bond is not required but effective heat dissipation is essential.


2. Applications

  • Automotive electronics (HEV, NEV, batteries)
  • Computers and peripherals
  • Telecommunications
  • Thermal interface between heat-generating semiconductors and heat sinks

3. Typical Properties

Uncured Material Properties

Property Value Test Method
Viscosity (1,500/sec), Part A & B 50,000 mPa·s (cP) ASTM D5099
Density 3.1 g/cc ASTM D792
Working Time @ 25°C 240 minutes
Shelf Life @ 25°C 150 days

Cure Schedule

Cure Condition Time
25°C 24 hours
100°C 30 minutes

Cured Material Properties

Property Value Test Method
Hardness (Shore 00) 75 ASTM D2240
Heat Capacity 0.8 J/g-K ASTM E1269
Flammability UL 94 V-0

Electrical Properties

Property Value Test Method
Dielectric Strength 450 V/mil ASTM D149
Dielectric Constant @ 1,000 Hz 7.9 ASTM D150
Volume Resistivity 1×10¹⁰ ohm-meter ASTM D257

Thermal Properties

Property Value Test Method
Thermal Conductivity 4.0 W/m-K ASTM D5470

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

RELATED PRODUCT

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.