1. Product Overview
BERGQUIST® GAP FILLER TGF 4400LVO is a two-part silicone-based gap filler designed for thermal management in electronic applications. It provides high thermal conductivity (4.4 W/(m.K)) and is suitable for thin bondline thicknesses, offering excellent heat dissipation. The product is compatible with automotive, industrial, and consumer applications.
2. Applications
3. Typical Properties
Uncured Material:
| Property | Part A | Part B | Mixed |
|---|---|---|---|
| Viscosity (Pa.s) | 600 | 500 | – |
| Shelf-life at 25°C (days) | 180* | 180* | – |
| Bondline thickness (µm) | – | – | 110 |
| Density (g/cc) | – | – | 3.1 |
| Working time @ 25°C (min) | – | – | 90 |
| Working time @ 40°C (min) | – | – | 30 |
Curing Performance:
| Cure Temperature | Time |
|---|---|
| 25°C | 12 hours |
| 40°C | 240 minutes |
| 100°C | <15 minutes |
Cured Material Properties:
| Property | Value |
|---|---|
| Hardness (Shore OO) | 85 |
| Heat Capacity (J/(g.K)) | ~0.95 |
| Flammability (UL 94) | V-0 |
| Dielectric constant (ASTM D150) | 8.0 |
| Dielectric strength (kV/mm) | >10 |
| Volume resistivity (Ω.m) | >1010 |
| Thermal conductivity (W/(m.K)) | >4.0 |
| Thermal resistance (@ 1mm) | 2.9 (K.cm²)/W |
Storage & Shipping:
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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