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BERGQUIST GAP FILLER TGF 4500CVO – Low Viscosity Thermally Conductive Gap Filler – Electronics and Power Modules

  • Item Name: BERGQUIST GAP FILLER TGF 4500CVO
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material (Liquid Gap Filler)
  • Technologies: 2K Silicone, Two-component, Thermally Conductive
  • Applications: Power inverter, Surface mount power switching, EV charger, Heat sink gap filler
  • Color: Part A – White, Part B – Pink, Cured – Pink
  • Cure Type: Room temperature or heat cure
  • Package Size: 50cc, 200cc, 400cc, 1,200cc cartridges; 6-gallon pail kits
  • Shelf Life: 6 months (180 days)

1. Product Overview

BERGQUIST GAP FILLER TGF 4500CVO is a two-component, thermally conductive, liquid gap-filling material with controlled volatile silicones. It is designed for high dispensing throughput and offers flexibility in curing at room temperature or with heat. Once cured, it forms a soft, thermally conductive elastomer that minimizes stress on components.

Key Benefits:

  • Thermal conductivity: 4.5 W/mK
  • Extended working time
  • Optimized viscosity for automated dispensing
  • High dispense throughput
  • Controlled volatile silicones

Curing Options:

  • Room Temperature Cure: 48 hours at 25°C
  • Heat Cure: 4 hours at 50°C or 30 minutes at 85°C

Operating Temperature: -60 to 200°C


2. Applications

  • Power inverters
  • Surface mount power switching
  • EV chargers
  • Heat dissipation for semiconductor packages

3. Typical Properties

Uncured Properties

Property Part A Part B Mixed
Appearance White Pink Pink
Viscosity (mPa·s) @ 1.0 s⁻¹ 522,000 361,000
Viscosity (mPa·s) @ 1,500 s⁻¹ 20,000 11,000
Density (g/cc) 3.2
Work Life 21 hours (25°C), 60 min (50°C), 3 min (85°C)

Cured Properties

Property Value
Hardness (Shore 00) 70
Heat Capacity (J/g-K) 0.8
Siloxane Content (ΣD4-D10, ppm) <300
Flammability (UL 94) V-0

Electrical Properties

Property Value
Volume Resistivity (Ω·m) 1×10¹¹
Dielectric Strength (V/mm) 10,000
Dielectric Constant @ 1kHz 8.1

Thermal Properties

Property Value
Thermal Conductivity (W/m·K) 4.5
Thermal Impedance @ 40 mil (°C-in²/W) 10% Deflection: 0.45
20% Deflection: 0.38
30% Deflection: 0.32

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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