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BERGQUIST® GAP PAD TGP 10000ULM – Thermally Conductive Gap Pad – High-Power Electronics and Thermal Management

  • Item Name: BERGQUIST® GAP PAD TGP 10000ULM
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material (TIM)
  • Technologies: Silicone-based, ultra-low modulus, high compliance
  • Applications: Telecommunications (routers, switches, base stations), optical transceivers, ASICs, DSPs
  • Color: Grey
  • Cure Type: Pre-formed gap pad (no curing required)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 6 months (180 days)

1. Product Overview

  • Description: Soft gap filling material with high thermal conductivity (10.0 W/m-K), designed for low-pressure applications with excellent thermal performance.
  • Technology: Silicone-based.
  • Appearance: Grey.
  • Operating Temperature Range: -60 to 200°C.
  • Flammability Rating: UL 94 V-0.
  • Applications: Used in thermal management and as a Thermal Interface Material (TIM).

2. Applications

  • Telecommunications: Routers, switches, base stations.
  • Optical Transceivers.
  • ASICs and DSPs.

3. Typical Properties

Property Value
Physical Properties
Hardness (Shore 000) 75
Density (g/cc) 3
Heat Capacity (J/g-K) 0.8
Shelf Life (days) 180
Young’s Modulus (kPa / psi) 173 / 25
Electrical Properties
Volume Resistivity (ohm-meter) 2.5×10¹¹
Dielectric Constant (1,000 Hz) 9.1
Dielectric Breakdown Voltage (VAC) 3,200 (40 mil sample)
Thermal Properties
Thermal Conductivity (W/m-K) 10

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