BERGQUIST GAP PAD TGP 6000ULM is a high-performance silicone thermal interface material with a thermal conductivity of 6.0 W/m-K. It features ultra-low modulus for high compliance and low compression stress. The material is highly conformal, suitable for surfaces with roughness or topography, and provides excellent interfacing and wet-out characteristics. It has inherent tack on both sides for easy assembly and rework and is reinforced with fiberglass for durability.
| Property | Value | Test Standard |
|---|---|---|
| Physical Properties | ||
| Hardness, Shore 000 | 60 | ASTM D2240 |
| Heat Capacity (J/g-K) | 1.0 | ASTM E1269 |
| Density (g/cc) | 3.2 | ASTM D792 |
| Young’s Modulus (kPa) | 41.3 (6 psi) | – |
| Flammability | ||
| UL Flammability Rating | V-0 | UL 94 |
| Electrical Properties | ||
| Dielectric Strength (VAC) | >5,000 | ASTM D149 |
| Dielectric Constant (1,000Hz) | 6.5 | ASTM D150 |
| Volume Resistivity (ohm-meter) | 1×10¹⁰ | ASTM D257 |
| Thermal Properties | ||
| Thermal Conductivity (W/m-K) | 6.0 | ASTM D5470 |
| Thermal Impedance (°C-in²/W) | ASTM D5470 | |
| – 10% Deflection | 0.34 | |
| – 20% Deflection | 0.29 | |
| – 30% Deflection | 0.26 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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