BERGQUIST® GAP PAD TGP 7000ULM BLU is a highly conformable silicone-based thermal interface material with exceptional thermal performance. It has an ultra-low modulus, allowing for minimal compression stress and excellent heat transfer. The material features a thermal conductivity of 7.5 W/m-K and does not exhibit mobile polymer bleed. It is designed for high-performance applications requiring low assembly stress and superior surface wet-out.
| Property | Value | Test Standard |
|---|---|---|
| Physical Properties | ||
| Hardness, Shore 000 | 70 | ASTM D2240 |
| Density (g/cc) | 3.2 | ASTM D792 |
| Heat Capacity (J/g-K) | 0.8 | ASTM E1269 |
| Young’s Modulus (psi) | 36 | – |
| Shelf Life (days) | 180 | – |
| Electrical Properties | ||
| Volume Resistivity (ohm-meter) | 2×10¹⁰ | ASTM D257 |
| Dielectric Constant (1,000Hz) | 7.4 | ASTM D150 |
| Dielectric Strength (KV/mil) | 412 | – |
| Thermal Properties | ||
| Thermal Conductivity (W/m-K) | 7.5 | ASTM D5470 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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