Conformable, Thermally Conductive Material for Filling Air Gaps
| Category | Test Method | Value |
|---|---|---|
| Physical Properties | ||
| Hardness (Shore 00) | ASTM D2240 | 40 |
| Heat Capacity (J/g-K) | ASTM E1269 | 1.0 |
| Density (g/cc) | ASTM D792 | 1.6 |
| Flammability | UL 94 | V-0 |
| Young’s Modulus (kPa) | ASTM D575 | 689 (100 psi) |
| Electrical Properties | ||
| Dielectric Breakdown Voltage (VAC) | ASTM D149 | >6,000 |
| Dielectric Constant (1,000Hz) | ASTM D150 | 5.5 |
| Volume Resistivity (ohm-meter) | ASTM D257 | 1×10¹¹ |
| Thermal Properties | ||
| Thermal Conductivity (W/m-K) | ASTM D5470 | 0.8 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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