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BERGQUIST HI FLOW THF 1500P – High-Flow Thermally Conductive Gap Filler – Electronics and Power Modules

  • Item Name: BERGQUIST HI FLOW THF 1500P (formerly BERGQUIST HI-FLOW 650P)
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Phase Change Material
  • Technologies: Phase Change, Polyimide-Reinforced Thermal Interface Material
  • Applications: Thermal management for power semiconductors, spring/clip-mounted devices, modules requiring electrical insulation
  • Color: Gold
  • Cure Type: Phase Change at 52°C
  • Package Size: Contact Techniq VN for details
  • Shelf Life: Contact Techniq VN for details

1. Product Overview
BERGQUIST HI FLOW THF 1500P (formerly known as BERGQUIST HI-FLOW 650P) is a high-performance, thermally conductive phase change material. It is electrically insulating and reinforced with a polyimide carrier, offering exceptional thermal performance and high-temperature reliability (up to 150°C). The material naturally has tack on one side, facilitating easy assembly.

2. Applications

  • Spring/clip-mounted devices
  • Discrete power semiconductors and modules
  • High-power electrical devices requiring electrical isolation from heat sinks
  • Ideal for automotive applications and automated dispensing systems

3. Typical Properties

Category Property Value Test Method
Physical Properties Elongation 40% ASTM D882
Tensile Strength 7,000 psi ASTM D882A
Phase Change Temperature 52°C ASTM D3418
Flammability Rating V-0 UL 94
Electrical Properties Dielectric Breakdown Voltage 5,000 Vac ASTM D149
Dielectric Constant (@ 1,000 Hz) 4.5 ASTM D150
Volume Resistivity 1×10¹² ohm-meter ASTM D257
Thermal Properties Thermal Conductivity 1.5 W/(m-K) ASTM D5470
Thermal Impedance (°C-in²/W) @ 25 psi 0.2 ASTM D5470
TO-220 Thermal Performance (°C/W) @ 25 psi 1.15 ASTM D5470

4. Features & Benefits

  • Low thermal impedance: 0.2°C-in²/W @ 25 psi
  • Reliable up to 150°C
  • One-side tack for easy handling
  • High dielectric strength with polyimide film reinforcement

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