Industries

BERGQUIST HI FLOW THF 3000UT – High-Flow Thermally Conductive Gap Filler – Electronics and Power Modules

  • Item Name: BERGQUIST HI FLOW THF 3000UT (Known as BERGQUIST HI-FLOW 565UT)
  • Manufacturer: Henkel
  • Product Category: Phase Change Thermal Interface Material (TIM)
  • Technologies: Phase Change, Un-Reinforced, Naturally Tacky
  • Applications:
    • Processor lid to heat sink
    • FBDIMM to heat spreader
    • Processor die to lid or heat sink
  • Color: Blue
  • Cure Type: Phase change at 52°C (softening)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

BERGQUIST HI FLOW THF 3000UT (also known as BERGQUIST HI-FLOW 565UT) is a tacky, high-performance, unreinforced phase change thermal interface material (TIM). It softens at 52°C, ensuring efficient thermal transfer by wetting out the thermal interfaces. The material is provided in tabulated pad form for ease of assembly.

2. Applications

  • Processor lid to heat sink
  • FBDIMM to heat spreader
  • Processor die to lid or heat sink

3. Typical Properties

Property Value Test Method
Appearance Blue
Technology Phase Change
Reinforcement Carrier None
Total Thickness 0.127 to 0.254 mm ASTM D374
Operating Temperature 125°C
Phase Change Temperature 52°C ASTM D3418
Flammability Rating UL 94 V-0
Thermal Conductivity 3.0 W/m-K ASTM D5470

Thermal Performance vs. Pressure

Pressure (psi) TO-220 Thermal Performance (°C/W) Thermal Impedance (°C-in²/W)
10 psi 0.37 0.09
25 psi 0.35 0.05
50 psi 0.34 0.03
100 psi 0.30 0.02
200 psi 0.26 0.02

Additional Features & Benefits

  • Naturally tacky for easy handling and assembly
  • No carrier reinforcement for improved thermal contact
  • Tabulated pad format enables high-volume applications
  • Comparable thermal performance to top thermal greases

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