Products

BERGQUIST HI FLOW THF 3000UT – High-Flow Thermally Conductive Gap Filler – Electronics and Power Modules

  • Item Name: BERGQUIST HI FLOW THF 3000UT (Known as BERGQUIST HI-FLOW 565UT)
  • Manufacturer: Henkel
  • Product Category: Phase Change Thermal Interface Material (TIM)
  • Technologies: Phase change, thermally conductive, un-reinforced, naturally tacky
  • Applications: Processor lid to heat sink, FBDIMM to heat spreader, processor die to lid or heat sink
  • Color: Blue
  • Cure Type: Phase change at 52°C
  • Package Size: Contact Techniq VN for details
  • Shelf Life: Contact Techniq VN for details

1. Product Overview

BERGQUIST HI FLOW THF 3000UT (also known as BERGQUIST HI-FLOW 565UT) is a tacky, high-performance, unreinforced phase change thermal interface material (TIM). It is designed to provide low thermal impedance and high thermal conductivity in various thermal management applications. The material undergoes a phase change softening at 52°C, allowing it to conform to surfaces and improve heat transfer.

2. Applications

  • Processor lid to heat sink
  • FBDIMM to heat spreader
  • Processor die to lid or heat sink

3. Typical Properties

Physical Properties

Property Value Test Method
Appearance Blue
Reinforcement Carrier None
Phase Change Temperature (°C) 52 ASTM D3418
Flammability Rating UL 94 V-0

Thermal Properties

Property Value Test Method
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
Thermal Impedance (°C-in²/W) ASTM D5470
@ 10 psi 0.09
@ 25 psi 0.05
@ 50 psi 0.03
@ 100 psi 0.02
@ 200 psi 0.02
TO-220 Thermal Performance (°C/W)
@ 10 psi 0.37
@ 25 psi 0.35
@ 50 psi 0.34
@ 100 psi 0.30
@ 200 psi 0.26

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