Applications

BERGQUIST LIQUI BOND TLB SA2000 – Silicone Adhesive – Thermal management for PCBAs, heat spreaders, housings

  • Item Name: BERGQUIST LIQUI BOND TLB SA2000

  • Manufacturer: Henkel

  • Technologies: Thermally conductive, one-part liquid silicone adhesive

  • Color: Yellow

  • Cure Type: Heat cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 6 months

1. Product Overview

BERGQUIST LIQUI-BOND TLB SA2000 is a thermally conductive, one-part silicone adhesive designed for thermal management applications. It offers a thermal conductivity of 2.0 W/m·K and cures with heat to form a durable elastomer. The product combines mechanical and chemical stability with mild elasticity, helping to alleviate CTE stresses during thermal cycling. Its single-component formulation allows for easy dispensing, and it requires refrigeration at 10 °C for optimal six-month shelf life.


2. Applications

  • PCBA to housing attachment.

  • Discrete component to heat spreader bonding.

3. Typical Properties

Property Still Not Mixed (Uncured) After Cured
Appearance Yellow
Technology Silicone
Viscosity (ASTM D2196, 25 °C) 200,000 mPa·s
Density (ASTM D792) 2.4 g/cc
Pot Life @ 25 °C 24 h
Shelf Life 6 months @ 10 °C
Cure Schedule 20 min @ 125 °C or 10 min @ 150 °C
Hardness (ASTM D2240) 80 Shore A
Dielectric Strength (ASTM D149) 10,000 V/mm
Dielectric Constant (ASTM D150 @1kHz) 6.0
Volume Resistivity (ASTM D257) 1×10¹¹ Ω·m
Thermal Conductivity (ASTM D5470) 2.0 W/m·K
Shear Strength (ASTM D1002) 1.4 MPa (200 psi)
Operating Temperature -60 to 200 °C
UL Flammability UL 94 V-0

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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