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BERGQUIST® LIQUI FORM TLF 4500CGEL-SF – Liquid Gap Filler – Power Electronics & LED Modules

  • Item Name: BERGQUIST® LIQUI FORM TLF 4500CGEL-SF
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material (TIM)
  • Technologies: Silicone-free, moisture-curable, thermally conductive gel
  • Applications: Automotive electronics, telecommunications, low-stress interfaces, semiconductor heat management
  • Color: Gray
  • Cure Type: Moisture cure (skin formation can be accelerated with heat)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

BERGQUIST® LIQUI FORM TLF 4500CGEL-SF is a one-part, high-performance, thermally conductive, silicone-free, moisture-curable gel. It provides a soft, form-in-place elastomer after curing, suitable for fragile assemblies and intricate gaps. This material is optimized for high-reliability applications, offering excellent temperature, mechanical, and chemical stability.

2. Applications

  • Automotive electronics (ADAS, EV, ECU)
  • Telecommunications
  • Devices requiring low assembly pressure
  • Computer peripherals
  • Between heat-generating semiconductors and a heat sink

3. Typical Properties

Before Mixing (Uncured Material)
Property Test Method Value
Dispense rate 45 g/min
Viscosity (low shear, 1.0 s⁻¹) DIN 53019 520 Pa·s
Viscosity (high shear, 1,500 s⁻¹) ASTM D5099 100 Pa·s
Density ASTM D792 3.1 g/cc
Shelf life (≤150cc cartridges) 90 days
Shelf life (≥150cc cartridges) 180 days
Curing Conditions
Condition Time Temperature
Recommended cure 24 hours 25°C, 50% RH
Accelerated curing Contact Henkel
After Mixing (Cured Material)
Property Test Method Value
Hardness (2 hrs @ 100°C) 75 (Shore 00)
Hardness (2 weeks @ 25°C, 50% RH) 50 (Shore 00)
Dielectric Strength ASTM D149 250 V/mil
Dielectric Constant (@ 1,000 Hz) ASTM D150 11
Volume Resistivity ASTM D257 1 × 10⁷ Ω·m
Heat Capacity ASTM E1269 0.84 J/g·°C
Thermal Conductivity ASTM D5470 4.5 W/m-K

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