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BERGQUIST LIQUI FORM TLF 6000HG – Thermal Gap Filler – High-Performance Electronics & Power Modules

  • Item Name: BERGQUIST LIQUI FORM TLF 6000HG
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material (TIM)
  • Technologies: One-part, pre-cured, thermally conductive gel
  • Applications: 5G base stations, remote antenna units, telecom wireless infrastructure, gap filling for heat-generating devices
  • Color: Gray
  • Cure Type: Pre-cured (no mixing or refrigeration required)
  • Package Size: 150 cc, 300 cc cartridges; 1 gal, 5 gal pails
  • Shelf Life: 12 months

1. Product Overview

BERGQUIST LIQUI FORM TLF 6000HG is a thermally conductive, one-part, liquid formable gel designed for thermal management applications. This pre-cured, dispensable gel offers high thermal conductivity (6.0 W/m-K), excellent chemical and mechanical stability, and is suitable for narrow gaps (≤3mm) in telecom applications like 5G base stations.

  • Technology: Silicone
  • Appearance: Gray paste
  • Application Method: Dispense from cartridge
  • Operating Temperature Range: -60 to 200°C

2. Applications

  • Thermal interface for RRU, AAU, and BBU in telecom infrastructure
  • Filling gaps between heat-generating devices and heat sinks
  • Applications requiring low assembly pressure
  • High-value assemblies that require rework

3. Typical Properties

Uncured Material

Property Test Method Value
Density (g/cc) ASTM D792 3.2
Shelf Life @ 25°C 365 days

Cured Material

Physical Properties

Property Test Method Value
Viscosity (Pa·s) (Low shear 1.0 s⁻¹) ASTM D2196 2,716
Viscosity (Pa·s) (High shear 100 s⁻¹) ASTM D5099 617
Dispense Rate (30cc syringe, 90 psi) 17 g/min
Outgassing (% total mass loss) ASTM E595 0.16
Flammability Rating UL 94 V-0

Electrical Properties

Property Test Method Value
Volume Resistivity (Ω·m) ASTM D257 4.37 × 10¹¹
Dielectric Strength (V/mm) ASTM D149 10,500
Dielectric Constant @ 1,000 Hz 7.95

Thermal Properties

Property Test Method Value
Thermal Conductivity (W/m-K) ASTM D5470 6.0

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