BERGQUIST LIQUI FORM TLF LF2000 is a high-performance, thermally conductive, one-part liquid formable material. It requires no curing, mixing, or refrigeration, offering excellent thermal management for various applications.
| Property | Test Method | Value |
|---|---|---|
| Viscosity (High Shear, 300 s⁻¹) | ASTM D2196 | 110 Pa·s |
| Viscosity (Low Shear, 0.001 s⁻¹) | ASTM D4473 | 20,000 mPa·s |
| Density | ASTM D792 | 2.8 g/cc |
| Shelf Life @ 25°C | – | 6 months |
| Property | Test Method | Value |
|---|---|---|
| Volumetric Expansion (25 to 275°C) | ASTM E228 (Modified) | 600 ppm/°C |
| Dielectric Strength | ASTM D149 | 10,000 V/mm |
| Dielectric Constant (1,000 Hz) | ASTM D150 | 8.0 |
| Volume Resistivity | ASTM D257 | 1×10⁹ Ω·m |
| Total Mass Loss (Outgassing) | ASTM E595 | 0.53% |
| Thermal Conductivity | ASTM D5470 | 2.0 W/m-K |
| Pressure | Thermal Impedance (°C-in²/W) |
|---|---|
| 10 psi | 0.13 |
| 25 psi | 0.12 |
| 50 psi | 0.12 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.