Item Name: BERGQUIST microTIM mTIM 1028
Manufacturer: Henkel
Technologies: Silicone thermoset, thermally conductive thin film
Color: Tan
Cure Type: Thermoset
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
BERGQUIST microTIM mTIM 1028 is a silicone thermoset thin film designed for thermal management in high-performance electronics. It provides consistent thermal conductivity, good durability, and abrasion resistance, even under repeated insertion and removal cycles. With an elastomeric structure, it offers resilience against mechanical stress while delivering improved heat transfer. The product is optimized for optical modules and aluminum or copper heat sink assemblies, supporting reliable performance under demanding conditions.
Heat sinks in riding cage assemblies for switches, servers, and routers.
Aluminum and copper heat sinks with electroless nickel plating (ASTM B733 Type IV, Class 1, SCO, ≥1 µm).
Pluggable optical modules (POMs) requiring robust thermal performance and resistance to abrasion.
| Property | Still Not Mixed (Uncured) | After Mixed / Cured |
|---|---|---|
| Technology | – | Silicone thermoset |
| Appearance | – | Tan |
| Thickness | – | 25 ± 5 µm |
| Durability Performance | – | <20% area abraded |
| Extraction Force | – | <11.2 lb-f |
| Silicone Extraction | – | NEBS Pass |
| UL Flammability | – | UL 94 V-0 |
| Volume Resistivity | – | >1 GΩ·m |
| Thermal Performance @16W | – | 0.33 °C/W (5 °C better than metal-to-metal baseline) |
| Thermal Performance @20W | – | 0.18 °C/W (3–4 °C better than baseline) |
| Operating Temperature | – | -40 to 125 °C |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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